公开(公告)号：US20210086294A1

公开(公告)日：2021-03-25

申请号：US16971501

申请日：2019-02-22

Applicant: CORNING INCORPORATED

Inventor： Hasan Fiaz ,  Jann Paul Kaminski ,  Raymond Miller Karam ,  Brian Nilsen ,  Marie Bernadette O'Regan ,  Garrett Andrew Piech ,  Charles Jueilei Wang ,  Ming Ying

IPC: B23K26/00 ,  C03C23/00 ,  C03C27/08 ,  C03B33/02 ,  B23K26/32

Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.

公开(公告)号：US11992894B2

公开(公告)日：2024-05-28

申请号：US16971501

申请日：2019-02-22

Applicant: CORNING INCORPORATED

Inventor： Hasan Fiaz ,  Jann Paul Kaminski ,  Raymond Miller Karam ,  Brian Nilsen ,  Marie Bernadette O'Regan ,  Garrett Andrew Piech ,  Sergio Tsuda ,  ChuanChe Wang ,  Ming Ying

IPC: B23K26/00 ,  B23K26/32 ,  C03B33/02 ,  C03C23/00 ,  C03C27/08

CPC classification number: B23K26/0006 ,  B23K26/32 ,  C03B33/0222 ,  C03C23/0025 ,  C03C27/08

Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.