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1.
公开(公告)号:US20130316631A1
公开(公告)日:2013-11-28
申请号:US13955683
申请日:2013-07-31
Applicant: CORNING INCORPORATED
Inventor: Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
IPC: B24B37/26
CPC classification number: B24B37/26 , B24B13/02 , B24B37/20 , B24D18/0009 , Y10T29/53796 , Y10T156/1028 , Y10T156/1031
Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
Abstract translation: 用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供:将抛光垫预成型放置在圆顶形成形表面上,所述抛光垫预成型件包括具有中心和外部的圆形主体 周缘,以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀,使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件,并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。
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公开(公告)号:US09004983B2
公开(公告)日:2015-04-14
申请号:US13955683
申请日:2013-07-31
Applicant: Corning Incorporated
Inventor: Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
CPC classification number: B24B37/26 , B24B13/02 , B24B37/20 , B24D18/0009 , Y10T29/53796 , Y10T156/1028 , Y10T156/1031
Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
Abstract translation: 用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供:将抛光垫预成型放置在圆顶形成形表面上,所述抛光垫预成型件包括具有中心和外部的圆形主体 周缘,以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀,使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件,并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。
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