公开(公告)号：US20250127174A1

公开(公告)日：2025-04-24

申请号：US18687557

申请日：2022-08-30

Applicant: CORNING INCORPORATED

Inventor： Bavani Balakrisnan ,  Xiaole Cheng ,  Todd Patrick Egan ,  Insik Jeon ,  Weijun Niu

IPC: A01N59/20 ,  A01N25/10 ,  A01N33/12 ,  A01N43/50 ,  A01N55/00 ,  A01P1/00

Abstract: Antimicrobial thermoset coating formulations including an additive compound and a thermo- or UV-curable resin are provided, especially where the additive is chosen from 1-butyl-3-methylimidazolium bromide, didecyldimethyl ammonium chloride, 1-cetylpyridinium chloride, hydroxyethylcellulose, carboxy methylcellulose, triethyl citrate, N-octadecyldimethyl-(3-(trimethoxysilyl)propyl)ammonium chloride, 4-(trimethoxysilylethyl)benzyltrimethylammonium chloride, N-[3-(trimethoxysilyl) propyl]-N,N,N-trimethylammonium chloride, dimethylbenzalkonium. Antimicrobial thermoset coating formulations further including a copper-containing material or cuprous oxide are provided. Methods of making the antimicrobial thermoset coating formulations are also provided. Methods for using the antimicrobial thermoset coating formulations are also provided. Antimicrobial systems are also provided.