FORMULATIONS FOR ANTIMICROBIAL THERMOSET COATINGS

    公开(公告)号:US20250127174A1

    公开(公告)日:2025-04-24

    申请号:US18687557

    申请日:2022-08-30

    Abstract: Antimicrobial thermoset coating formulations including an additive compound and a thermo- or UV-curable resin are provided, especially where the additive is chosen from 1-butyl-3-methylimidazolium bromide, didecyldimethyl ammonium chloride, 1-cetylpyridinium chloride, hydroxyethylcellulose, carboxy methylcellulose, triethyl citrate, N-octadecyldimethyl-(3-(trimethoxysilyl)propyl)ammonium chloride, 4-(trimethoxysilylethyl)benzyltrimethylammonium chloride, N-[3-(trimethoxysilyl) propyl]-N,N,N-trimethylammonium chloride, dimethylbenzalkonium. Antimicrobial thermoset coating formulations further including a copper-containing material or cuprous oxide are provided. Methods of making the antimicrobial thermoset coating formulations are also provided. Methods for using the antimicrobial thermoset coating formulations are also provided. Antimicrobial systems are also provided.

    ANTIMICROBIAL POLYMER COMPOSITIONS, ANTIMICROBIAL POLYMER ARTICLES, AND METHODS OF MAKING THE SAME

    公开(公告)号:US20250127175A1

    公开(公告)日:2025-04-24

    申请号:US18711723

    申请日:2022-11-21

    Abstract: An antimicrobial polymer composition comprises from about 5 wt % to about 30 wt % of a copper-containing material, from about 5 wt % to about 30 wt % of an ionic liquid, and from 60 wt % to 90 wt % of a thermoplastic polymer. An antimicrobial polymer article comprises from 0.1 wt % to about 30 wt % of a copper-containing material, from about 0.1 wt % to about 20 wt % of an ionic liquid, and from about 50 wt % to about 99.8 wt % of a thermoplastic polymer. Methods of making an antimicrobial polymer can comprise feeding an antimicrobial polymer composition and an another thermoplastic polymer into a forming apparatus. Methods of making an antimicrobial polymer article comprises feeding a mixture comprising copper-containing material from about 0.1 wt % to about 30 wt %, an ionic liquid from about 0.1 wt % to about 20 wt %, and a thermoplastic polymer into a forming apparatus.

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