公开(公告)号：US11919125B2

公开(公告)日：2024-03-05

申请号：US16583696

申请日：2019-09-26

Applicant: CORNING INCORPORATED

Inventor： Lance Changyong Kim ,  Fei Lu ,  Xu Ouyang ,  Yeguang Pan

IPC: B24B37/30 ,  B24B37/20 ,  H01L21/683

CPC classification number: B24B37/30 ,  B24B37/20 ,  H01L21/6835

Abstract: A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or ceramic material, wherein the carrier wafer has a diameter of from 250 mm to 450 mm and a thickness of from 0.5 mm to 2 mm after lapping; and polishing the first surface of the carrier wafer with at least one of a differential pressure, a differential speed or a differential time between a center portion and an edge portion of the carrier wafer such that the first surface has a convex or concave shape.