公开(公告)号：US20220176678A1

公开(公告)日：2022-06-09

申请号：US17602107

申请日：2020-03-30

Applicant: CORNING INCORPORATED

Inventor： Vikram Bhatia ,  Zhang Liu ,  Ah-Young Park ,  Yousef Kayed Qaroush

IPC: B32B17/10 ,  B32B7/027 ,  B32B7/12

Abstract: A cold-formed glass laminate (100) may include a first ply (108) of 3D formed glass with a first thickness, a first strength, and a first coefficient of thermal expansion. The laminate (100) may also include a second ply (110) of 3D formed glass with a second thickness less than the first thickness, a second strength greater than the first strength, and a second coefficient of thermal expansion. The second coefficient of thermal expansion may be selected to be sufficiently higher than the first coefficient of thermal expansion to induce residual compressive stresses in the first ply (108) due to cold forming therewith. An adhesive layer (112) may be arranged between the first ply (108) and the second ply (110).

公开(公告)号：US12122124B2

公开(公告)日：2024-10-22

申请号：US17602107

申请日：2020-03-30

Applicant: CORNING INCORPORATED

Inventor： Vikram Bhatia ,  Zhang Liu ,  Ah-Young Park ,  Yousef Kayed Qaroush

IPC: B32B15/04 ,  B32B7/027 ,  B32B17/06 ,  B32B17/10

CPC classification number: B32B17/10036 ,  B32B7/027 ,  B32B17/10816 ,  B32B2307/30

Abstract: A cold-formed glass laminate (100) may include a first ply (108) of 3D formed glass with a first thickness, a first strength, and a first coefficient of thermal expansion. The laminate (100) may also include a second ply (110) of 3D formed glass with a second thickness less than the first thickness, a second strength greater than the first strength, and a second coefficient of thermal expansion. The second coefficient of thermal expansion may be selected to be sufficiently higher than the first coefficient of thermal expansion to induce residual compressive stresses in the first ply (108) due to cold forming therewith. An adhesive layer (112) may be arranged between the first ply (108) and the second ply (110).