公开(公告)号：US20240351312A1

公开(公告)日：2024-10-24

申请号：US18761977

申请日：2024-07-02

Applicant: CORNING INCORPORATED

Inventor： Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Natesan Venkataraman

IPC: B32B17/06 ,  B32B7/027 ,  C03B17/06 ,  C03B27/04 ,  C03B27/052 ,  C03C21/00 ,  C03C23/00

CPC classification number: B32B17/06 ,  C03B17/064 ,  C03B27/0413 ,  C03B27/0526 ,  C03C21/002 ,  C03C23/007 ,  B32B7/027 ,  B32B2307/50 ,  C03C2203/50

Abstract: A laminated glass article comprises a core layer comprising a core glass composition having an average core coefficient of thermal expansion (CTEcore) and a clad layer directly adjacent to the core layer and comprising a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore such that the clad layer is in compression and the core layer is in tension. A compressive stress of the clad layer increases with increasing distance from the outer surface of the clad layer, transitions to a minimum tensile stress as a step-change at an interface region between the core layer and the clad layer, and a magnitude of the tensile stress increases continuously to a maximum tensile stress in the core layer. Other stress profiles, and methods of preparing laminated glass articles are also disclosed.

公开(公告)号：US12103294B2

公开(公告)日：2024-10-01

申请号：US17524871

申请日：2021-11-12

Applicant: SHT Smart High-Tech AB

Inventor： Johan Liu ,  Nan Wang

IPC: B32B9/00 ,  B32B5/16 ,  B32B7/027 ,  B32B7/12 ,  B32B9/04 ,  C01B32/194 ,  F28F3/02 ,  F28F21/02 ,  H05K7/20 ,  B32B37/12 ,  B32B37/24 ,  B32B38/00 ,  B32B38/10 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: B32B9/007 ,  B32B5/16 ,  B32B7/027 ,  B32B7/12 ,  B32B9/04 ,  C01B32/194 ,  F28F3/02 ,  F28F21/02 ,  H05K7/2039 ,  B32B2037/1253 ,  B32B37/24 ,  B32B38/004 ,  B32B38/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2264/108 ,  B32B2307/302 ,  B32B2313/04 ,  B32B2319/00 ,  B32B2333/00 ,  B32B2363/00 ,  B32B2375/00 ,  B32B2379/08 ,  B32B2457/00 ,  B82Y30/00 ,  B82Y40/00 ,  Y10T156/1062 ,  Y10T156/108

Abstract: Heat sink and method of manufacturing a graphene based heat sink, the method comprising: providing a first and second graphene film; arranging a layer of nanoparticles on a surface of the first and second graphene film to improve an adhesion strength between the graphene films; attaching the second graphene film to the first graphene film by means of an adhesive and the layer of nanoparticles; forming a laminated graphene film comprising a number of graphene film layers by repeating the steps, wherein the laminated graphene film is formed to have an anisotropic thermal conductivity; assembling a plurality of laminated graphene films by applying pressure and heat to cure the adhesive to form a graphene block; and removing selected portions of the graphene block to form a heat sink comprising fins extending from a base plate of the heat sink.

公开(公告)号：US20240316897A1

公开(公告)日：2024-09-26

申请号：US18580341

申请日：2022-07-20

Applicant: Toray Industries, Inc.

Inventor： Keisuke Shiozaki ,  Kenya Okada ,  Tatsuya Abe

IPC: B32B5/24 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/027 ,  B32B27/12 ,  B32B27/32 ,  H05K5/02

CPC classification number: B32B5/245 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/027 ,  B32B27/12 ,  B32B27/32 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2266/025 ,  B32B2307/302 ,  B32B2307/72 ,  B32B2457/00 ,  H05K5/0217

Abstract: A thermally conductive, light, and rigid integrally molded body includes a laminate that is excellent in thermal conductivity, lightness, and rigidity and integrated with one or more other members is provided. An integrally molded body includes a laminate including at least prepregs that are laminated and made of a continuous carbon fiber and a resin, and a structure made of a thermoplastic resin and a reinforcing fiber and disposed on a periphery of the laminate, in which the prepregs include a first prepreg constituting the outermost layer of the laminate and including a continuous carbon fiber having a thermal conductivity λ1A of 100 (W/(m·K)) or more and 800 (W/(m·K)) or less in a fiber direction. The integrally molded body is preferably used for an electronic device housing.

公开(公告)号：US20240308198A1

公开(公告)日：2024-09-19

申请号：US18121996

申请日：2023-03-15

Applicant: Samuel J. Osten ,  Collin R. Gilarno ,  Michael A. Maravola

Inventor： Samuel J. Osten ,  Collin R. Gilarno ,  Michael A. Maravola

IPC: B32B37/06 ,  B32B7/027 ,  B32B27/08 ,  B32B27/32

CPC classification number: B32B37/06 ,  B32B7/027 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/04 ,  B32B2250/242 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2307/518 ,  B32B2307/706 ,  B32B2307/732 ,  B32B2605/00 ,  B32B2607/00

Abstract: A composite panel is provided comprising first and third polymer plies having fibers therein that are substantially parallel to a first fiber axis and a second polymer ply having fibers therein that are substantially parallel to a second fiber axis. The first polymer ply comprises material with a first melting temperature, and the second and third polymer plies comprise material with a second melting temperature higher than the first melting temperature. Plies are bonded together to form a composite by heating the plies at a first heating temperature that is higher than the second melting temperature. First polymer ply material is provided at a first side of the composite. The first side of the composite is positioned adjacent to the core, and the composite and the core are heated at a second heating temperature that is higher than the first melting temperature but lower than the second melting temperature.

公开(公告)号：US12070932B2

公开(公告)日：2024-08-27

申请号：US17907821

申请日：2021-02-27

Applicant: PFNONWOVENS HOLDING S.R.O. ,  PFNONWOVENS CZECH S.R.O. ,  PFN—GIC A.S.

Inventor： Pavlina Kasparkova ,  Michael Kauschke ,  Zdenek Mecl

IPC: B32B5/02 ,  B32B7/022 ,  B32B7/027 ,  B32B7/05 ,  B32B37/00 ,  B32B37/04 ,  B32B37/06 ,  B32B38/00

CPC classification number: B32B5/022 ,  B32B7/022 ,  B32B7/027 ,  B32B7/05 ,  B32B37/0084 ,  B32B37/04 ,  B32B37/06 ,  B32B38/0036 ,  B32B2250/02 ,  B32B2250/20 ,  B32B2250/24 ,  B32B2305/20 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2310/0454 ,  B32B2323/04 ,  B32B2367/00 ,  B32B2377/00

Abstract: Layered nonwoven textile containing



a first layer (T) of filaments, which contains endless filaments containing a first carrier polymer (A1) and a first binding polymer (B1), which forms at least a part of surface of said endless filaments and which has a melting temperature at least 5° C. lower than the first carrier polymer (A1), wherein the first layer (T) of filaments contains bonding points in a spaced arrangement, wherein the bonding points interconnect the filaments and are formed by the first binding polymer (B1),
a second layer (M) of filaments, which contains filaments containing a carrier material, the stiffness of which is lower than the stiffness of the first carrier polymer (A1), and a second binding polymer (B2), which has a melting temperature at least 5° C., preferably at least 10° C., lower than the carrier material and the first carrier polymer (A1), wherein the second layer (M) of filaments contains bonding points in a spaced arrangement, wherein the bonding points interconnect the filaments of the second layer (M) and are formed by the second binding polymer (B1).

公开(公告)号：US12058811B2

公开(公告)日：2024-08-06

申请号：US18053365

申请日：2022-11-07

Applicant: AZOTEK CO., LTD.

Inventor： Hung-Jung Lee

IPC: H05K1/03 ,  B32B7/027 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/36 ,  B32B37/04 ,  B32B37/10 ,  B32B37/14 ,  B32B37/16 ,  H05K3/46

CPC classification number: H05K1/032 ,  B32B7/027 ,  B32B15/09 ,  H05K3/4626 ,  B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B37/04 ,  B32B37/10 ,  B32B37/144 ,  B32B37/16 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2250/42 ,  B32B2270/00 ,  B32B2305/55 ,  B32B2307/30 ,  B32B2307/704 ,  B32B2309/02 ,  B32B2311/00 ,  B32B2367/00 ,  B32B2457/08 ,  H05K1/036 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0141

Abstract: A multilayer board includes laminates. Each of the laminates includes a liquid crystal polymer substrate and a metal layer. Each of the liquid crystal polymer substrates has a melting point. When a number of the liquid crystal polymer substrates is an odd number, they include a first middle substrate that is located in the most middle position and has a first melting point lowest among the melting points. The melting points increase in a direction away from the first middle substrate. When the number of the liquid crystal polymer substrates is an even number, they include second and third middle substrates that are located in the most middle position and respectively have second and third melting points that are substantially same. The second or third melting point is lowest among the melting points. The melting points increase in a direction away from the second and third middle substrates.

公开(公告)号：US12012518B2

公开(公告)日：2024-06-18

申请号：US17203754

申请日：2021-03-17

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Wen-Cheng Yang ,  Te-Chao Liao ,  Chia-Yen Hsiao ,  Wen-Jui Cheng

IPC: C09D167/02 ,  B29B17/04 ,  B29C48/00 ,  B29C48/08 ,  B29C48/21 ,  B29C48/22 ,  B29K67/00 ,  B29K105/26 ,  B32B7/02 ,  B32B7/027 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/36 ,  C08G63/183 ,  C08J11/06 ,  C08J11/22 ,  C08J11/24

CPC classification number: C09D167/02 ,  B32B7/02 ,  B32B7/027 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/36 ,  C08G63/183 ,  C08J11/06 ,  C08J11/22 ,  C08J11/24 ,  B29B17/04 ,  B29C48/022 ,  B29C48/08 ,  B29C48/21 ,  B29C48/22 ,  B29K2067/003 ,  B29K2105/26 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/244 ,  B32B2250/40 ,  B32B2264/06 ,  B32B2270/00 ,  B32B2272/00 ,  B32B2307/30 ,  B32B2307/718 ,  B32B2307/732 ,  B32B2439/60 ,  C08J2367/02 ,  C08J2467/02 ,  Y02W30/62

Abstract: A polyester film for laser embossing and a method for manufacturing the same are provided. The polyester film for laser embossing is made from a recycled polyester material, and includes a base layer and a skin layer. The skin layer is disposed on at least one surface of the base layer. The skin layer is formed from a first polyester composition. The first polyester composition includes regenerated polyethylene terephthalate as a main component and at least one component selected from 1,4-butanediol, isophthalic acid, neopentyl glycol, 2-methyl-1,3-propanediol, pentanediol, isopentyldiol, adipic acid, and 1,4-cyclohexanedimethanol, so that a melting point of the skin layer ranges from 190° C. to 240° C.

公开(公告)号：US12005633B2

公开(公告)日：2024-06-11

申请号：US18273034

申请日：2022-12-16

Applicant: Jiangsu University

Inventor： Shu Huang ,  Hang Zhang ,  Jianzhong Zhou ,  Jie Sheng ,  Jiean Wei ,  Hongwei Yang ,  Cheng Wang ,  Mingyuan Shan

IPC: B29C64/129 ,  B29K75/00 ,  B29K507/04 ,  B32B7/027 ,  B32B27/08 ,  B32B27/20 ,  B32B27/40 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: B29C64/129 ,  B32B7/027 ,  B32B27/08 ,  B32B27/20 ,  B32B27/40 ,  B33Y10/00 ,  B33Y80/00 ,  B29K2075/00 ,  B29K2507/04 ,  B32B2264/10

Abstract: The present disclosure provides a method for photo-curing 4D printing of a multi-layer structure with an adjustable shape recovery speed, and a multi-layer structure printed thereby. The multi-layer structure printed by the method for photo-curing 4D printing of the multi-layer structure with the adjustable shape recovery speed includes a plurality of deformation units sequentially connected in series, and each of the plurality of the deformation units includes two slow layers, a fast layer, and a transition layer; and the fast layer is arranged between the two slow layers, and the transition layer is arranged between at least one of the two slow layers and the fast layer. In the present disclosure, a low cross-linking layer is doped with a nanocarbon light-absorbing material to solve the problem that the low cross-linking layer is prone to over-curing when a high cross-linking layer is printed on the low cross-linking layer.

公开(公告)号：US20240186628A1

公开(公告)日：2024-06-06

申请号：US18287694

申请日：2022-04-27

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Miho SASAKI ,  Takanori YAMASHITA ,  Ryo FUJIWARA

IPC: H01M50/197 ,  B32B3/04 ,  B32B7/027 ,  B32B7/14 ,  B32B27/08 ,  B32B27/30 ,  C09J5/06 ,  C09J7/35 ,  H01G11/78 ,  H01M50/105 ,  H01M50/121 ,  H01M50/126 ,  H01M50/131 ,  H01M50/193

CPC classification number: H01M50/197 ,  B32B3/04 ,  B32B7/027 ,  B32B7/14 ,  B32B27/08 ,  B32B27/30 ,  C09J5/06 ,  C09J7/35 ,  H01M50/105 ,  H01M50/121 ,  H01M50/126 ,  H01M50/131 ,  H01M50/193 ,  B32B2250/24 ,  B32B2307/31 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2307/7376 ,  B32B2457/10 ,  B32B2457/16 ,  C09J2203/326 ,  C09J2203/33 ,  C09J2301/1242 ,  C09J2301/304 ,  C09J2400/228 ,  C09J2423/04 ,  C09J2423/10 ,  C09J2467/006 ,  H01G11/78

Abstract: An adhesive film used for an electricity storage device, wherein the electricity storage device is accommodated in a package formed by an electricity storage device exterior material, the electricity storage device exterior material is constituted by at least a laminate including a base material layer, a barrier layer, and a heat-fusible resin layer from the outside, the electrical storage device element is accommodated in the package by heat fusing the heat-fusible resin layers of the electricity storage device exterior material to each other, the adhesive film is used by being interposed between the heat-fusible resin layers at a position where the heat-fusible resin layers are heat-fused to each other, and the adhesive film has a multilayer structure and includes at least one resin layer L having a melting peak temperature lower by 5° C. or more than that of the heat-fusible resin layers of the electricity storage device exterior material.

公开(公告)号：US20240092052A1

公开(公告)日：2024-03-21

申请号：US17932419

申请日：2022-09-15

Applicant: SAUDI ARABIAN OIL COMPANY

Inventor： Abderrahim Fakiri ,  Waleed Al Nasser ,  Thibault T. Villette

IPC: B32B1/08 ,  B29C63/00 ,  B29C63/34 ,  B29C70/22 ,  B29C70/30 ,  B32B5/08 ,  B32B5/12 ,  B32B7/027 ,  B32B27/08 ,  B32B27/12 ,  B32B37/06 ,  B32B37/14 ,  B32B37/20

CPC classification number: B32B1/08 ,  B29C63/0021 ,  B29C63/0069 ,  B29C63/34 ,  B29C70/22 ,  B29C70/30 ,  B32B5/08 ,  B32B5/12 ,  B32B7/027 ,  B32B27/08 ,  B32B27/12 ,  B32B37/065 ,  B32B37/144 ,  B32B37/206 ,  B29L2023/22

Abstract: A thermoplastic pipe and a method for producing it are described. The thermoplastic pipe includes a hollow inner liner layer, a semi-consolidated core comprising commingled fibers, and a shrink wrap outer layer. The commingled fibers comprise at least one thermoplastic fiber and at least one reinforcing fiber. The semi-consolidated core layer comprises a thermoplastic polymer matrix that is organized along the at least one reinforcing fiber. The method includes winding commingled fibers over the hollow inner liner layer at a designated angle to produce a core layer, covering the core layer in a heat shrinkable wrap, and heating to produce a semi-consolidated core layer. The semi-consolidated core layer comprises a thermoplastic polymer matrix that is organized along the at least one reinforcing fiber.