公开(公告)号：US10026683B2

公开(公告)日：2018-07-17

申请号：US15562863

申请日：2016-04-06

申请人： CORNING PRECISION MATERIALS CO., LTD.

发明人： Hyun Hang Park ,  Bo Gyeong Kim ,  Hyun Bin Kim ,  Sung Hoon Lee

IPC分类号： H01L23/498

摘要： The present invention relates to an integrated circuit package substrate and, more specifically, to an integrated circuit package substrate, which exhibits excellent conductivity and reliability through the improvement of an adhesive force between a metal line for electrically connecting an upper part and a lower part of the integrated circuit package substrate and glass formed inside the integrated circuit package substrate. To this end, the present invention provides the integrated circuit package substrate comprising: a core part made of glass; a first metal thin plate formed on the upper part of the core part and made of Cu; a second metal thin plate formed at the lower part of the core part and made of Cu; a metal line formed in a shape in which the metal line penetrates through the first metal thin plate, the core part, and the second metal thin plate so as to electrically connect the first metal thin plate and the second metal thin plate, and made of Cu; and an intermediate layer formed on the outer circumferential surface of the metal line, wherein the intermediate layer includes any one of Cu2O, Cu2O doped with a transition metal, and a metal oxide including Cu and a transition metal.