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    Integrated circuit package substrate
    2.
    发明授权
    Integrated circuit package substrate 有权

    公开(公告)号：US10026683B2

    公开(公告)日：2018-07-17

    申请号：US15562863

    申请日：2016-04-06

    申请人： CORNING PRECISION MATERIALS CO., LTD.

    发明人： Hyun Hang Park ,  Bo Gyeong Kim ,  Hyun Bin Kim ,  Sung Hoon Lee

    IPC分类号： H01L23/498

    摘要： The present invention relates to an integrated circuit package substrate and, more specifically, to an integrated circuit package substrate, which exhibits excellent conductivity and reliability through the improvement of an adhesive force between a metal line for electrically connecting an upper part and a lower part of the integrated circuit package substrate and glass formed inside the integrated circuit package substrate. To this end, the present invention provides the integrated circuit package substrate comprising: a core part made of glass; a first metal thin plate formed on the upper part of the core part and made of Cu; a second metal thin plate formed at the lower part of the core part and made of Cu; a metal line formed in a shape in which the metal line penetrates through the first metal thin plate, the core part, and the second metal thin plate so as to electrically connect the first metal thin plate and the second metal thin plate, and made of Cu; and an intermediate layer formed on the outer circumferential surface of the metal line, wherein the intermediate layer includes any one of Cu2O, Cu2O doped with a transition metal, and a metal oxide including Cu and a transition metal.

    METAL-BONDED SUBSTRATE
    3.
    发明申请
    METAL-BONDED SUBSTRATE 审中-公开

    公开(公告)号：US20180015699A1

    公开(公告)日：2018-01-18

    申请号：US15545793

    申请日：2016-01-06

    申请人： Corning Precision Materials Co., Ltd.

    发明人： Bo Gyeong Kim ,  Hyun Bin Kim ,  Sung Hoon Lee

    IPC分类号： B32B17/06 ,  B32B15/20

    CPC分类号： B32B17/061 ,  B32B15/20

    摘要： The present invention relates to a metal-bonded substrate and, more specifically, to a metal-bonded substrate in which the bonding force between a nonconductive substrate and a metal layer bonded to each other is remarkably improved. To this end, the present invention provides a metal-bonded substrate comprising: a substrate; a metal layer formed on the substrate; and a self-assembled monomolecular layer formed between the substrate and the metal layer, and composed of a silane chemically linking the substrate and the metal layer, wherein the end group of the silane is composed of an aminosilane containing a saturated or unsaturated hetero atom of a six-membered ring.

    METHOD OF FABRICATING LIGHT-SCATTERING SUBSTRATE
    4.
    发明申请
    METHOD OF FABRICATING LIGHT-SCATTERING SUBSTRATE 有权
    制造光散射基板的方法

    公开(公告)号：US20140356527A1

    公开(公告)日：2014-12-04

    申请号：US14294868

    申请日：2014-06-03

    申请人： CORNING PRECISION MATERIALS CO., LTD.

    发明人： Gun Sang Yoon ,  Hyun Bin Kim ,  June Hyoung Park

    IPC分类号： C23C16/40

    CPC分类号： C23C16/405 ,  H01L51/5268

    摘要： A method of fabricating a light-scattering substrate, a light-scattering substrate fabricated by the same method, and an organic light-emitting device (OLED) including the same light-scattering substrate, in which a light-scattering layer of the light-scattering substrate can improve a light extraction efficiency. The method fabricates the light-scattering substrate by chemical vapor deposition, and includes loading a base substrate into a chamber, and forming a light-scattering layer on the base substrate by supplying a Ti source and an oxidizer including H2O into the chamber. In the process of forming the light-scattering layer, the mole ratio of the H2O with respect to the Ti is 10 or greater.

    摘要翻译： 制造光散射衬底的方法，通过相同方法制造的光散射衬底和包括相同的光散射衬底的有机发光器件（OLED），其中发光元件的光散射层， 散射衬底可以提高光提取效率。 该方法通过化学气相沉积法制造光散射衬底，并且包括将基底衬底加载到腔室中，并且通过将Ti源和包括H 2 O的氧化剂供应到腔室中而在基底衬底上形成光散射层。 在形成光散射层的过程中，H 2 O相对于Ti的摩尔比为10以上。

    Method Of Manufacturing Thermochromic Substrate
    5.
    发明申请
    Method Of Manufacturing Thermochromic Substrate 有权
    制备热变色基板的方法

    公开(公告)号：US20130149441A1

    公开(公告)日：2013-06-13

    申请号：US13712086

    申请日：2012-12-12

    申请人： Samsung Corning Precision Materials Co., Ltd.

    发明人： Yong Won Choi ,  Yung-Jin Jung ,  Hyun Bin Kim ,  Seulgi Bae

    IPC分类号： B05D5/06

    CPC分类号： C23C14/08 ,  B05D5/065 ,  C03C17/3417 ,  C03C2218/322 ,  C23C14/022 ,  G02F1/0147

    摘要： A method of manufacturing a thermochromic substrate, with which transmittance can be increased. The method includes the steps of forming a first thin film as a coating on a base substrate, the refractive index of the first thin film being different from that of a VO2 thin film; forming a pre-thermochromic thin film by coating the first thin film with pure vanadium; forming a second thin film as a coating on the pre-thermochromic thin film, the refractive index of the second thin film being different from that of a VO2 thin film; and heat-treating a resultant stack that includes the base substrate, the first thin film, the pre-thermochromic thin film and the second thin film.

    摘要翻译： 制造能够提高透射率的热致变色基板的方法。 该方法包括以下步骤：在基底基板上形成作为涂层的第一薄膜，第一薄膜的折射率不同于VO2薄膜的折射率; 通过用纯钒涂覆第一薄膜来形成预热变色薄膜; 在预热变色薄膜上形成作为涂层的第二薄膜，第二薄膜的折射率不同于VO2薄膜的折射率; 并且对包括基底基板，第一薄膜，预热变色薄膜和第二薄膜的所得堆叠进行热处理。

    Method of fabricating light-scattering substrate
    7.
    发明授权
    Method of fabricating light-scattering substrate 有权
    制造光散射衬底的方法

    公开(公告)号：US09464351B2

    公开(公告)日：2016-10-11

    申请号：US14294868

    申请日：2014-06-03

    申请人： CORNING PRECISION MATERIALS CO., LTD.

    发明人： Gun Sang Yoon ,  Hyun Bin Kim ,  June Hyoung Park

    IPC分类号： C23C16/00 ,  C23C16/40 ,  H01L51/52

    CPC分类号： C23C16/405 ,  H01L51/5268

    摘要： A method of fabricating a light-scattering substrate, a light-scattering substrate fabricated by the same method, and an organic light-emitting device (OLED) including the same light-scattering substrate, in which a light-scattering layer of the light-scattering substrate can improve a light extraction efficiency. The method fabricates the light-scattering substrate by chemical vapor deposition, and includes loading a base substrate into a chamber, and forming a light-scattering layer on the base substrate by supplying a Ti source and an oxidizer including H2O into the chamber. In the process of forming the light-scattering layer, the mole ratio of the H2O with respect to the Ti is 10 or greater.

    摘要翻译： 制造光散射衬底的方法，通过相同方法制造的光散射衬底和包括相同的光散射衬底的有机发光器件（OLED），其中发光元件的光散射层， 散射衬底可以提高光提取效率。 该方法通过化学气相沉积法制造光散射衬底，并且包括将基底衬底加载到腔室中，并且通过将Ti源和包括H 2 O的氧化剂供应到腔室中而在基底衬底上形成光散射层。 在形成光散射层的过程中，H 2 O相对于Ti的摩尔比为10或更大。