公开(公告)号：US20210265250A1

公开(公告)日：2021-08-26

申请号：US17314160

申请日：2021-05-07

申请人： CREE, INC.

发明人： Marvin MARBELL ,  Arthur PUN ,  Jeremy FISHER ,  Ulf ANDRE ,  Alexander KOMPOSCH

IPC分类号： H01L23/498 ,  H01L23/66

摘要： An RF transistor package includes a metal submount; a transistor die mounted to the metal submount; and a surface mount IPD component mounted to the metal submount. The surface mount IPD component includes a dielectric substrate that includes a top surface and a bottom surface and at least a first pad and a second pad arranged on a top surface of the surface mount IPD component; at least one surface mount device includes a first terminal and a second terminal, the first terminal of the surface mount device mounted to the first pad and the second terminal mounted to the second pad; at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by the dielectric substrate; and at least one wire bond bonded to the at least one of the first pad and the second pad.

公开(公告)号：US20220399318A1

公开(公告)日：2022-12-15

申请号：US17342925

申请日：2021-06-09

申请人： CREE, INC

发明人： Eng Wah WOO ,  Samantha CHEANG ,  Kok Meng KAM ,  Marvin MABELL ,  Haedong JANG ,  Alexander KOMPOSCH

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L23/047 ,  H01L23/66 ,  H01L21/48

摘要： A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.

公开(公告)号：US20210233877A1

公开(公告)日：2021-07-29

申请号：US17228978

申请日：2021-04-13

申请人： CREE, INC.

发明人： Xikun ZHANG ,  Dejiang CHANG ,  Bill AGAR ,  Michael LEFEVRE ,  Alexander KOMPOSCH

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H01L25/07 ,  H01L25/00 ,  H01L29/16

摘要： A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material, a second semiconductor die attached to the same thermally conductive flange as the first semiconductor die via a second die attach material, and leads attached to the thermally conductive flange or to an insulating member secured to the flange. The leads are configured to provide external electrical access to the first and second semiconductor dies. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. Additional multi-die package embodiments are described.