专利检索 ap:("CREE, INC") AND inv:"Samantha CHEANG" 第 1 页

1.

发明申请
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME 有权

公开(公告)号：US20220399318A1

公开(公告)日：2022-12-15

申请号：US17342925

申请日：2021-06-09

申请人： CREE, INC

发明人： Eng Wah WOO , Samantha CHEANG , Kok Meng KAM , Marvin MABELL , Haedong JANG , Alexander KOMPOSCH

IPC分类号： H01L25/16 , H01L23/00 , H01L23/047 , H01L23/66 , H01L21/48

摘要： A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.