Leadless device with overmolded components

    公开(公告)号:US10029107B1

    公开(公告)日:2018-07-24

    申请号:US15880221

    申请日:2018-01-25

    Abstract: An electronics module for use in an Implantable Medical Device (IMD) may include a plurality of electrical components connected to form a circuit that includes a terminal and a potting material that supports the plurality of electrical components. The plurality of electrical components and the potting material together form a circuit sub-module in which the terminal is accessible from outside of the circuit sub-module. A metallic layer that conforms to an outer surface of the circuit sub-module is provided thereon such that the terminal is accessible from outside of the metallic layer.

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