公开(公告)号：US20060141907A1

公开(公告)日：2006-06-29

申请号：US11291067

申请日：2005-12-01

申请人： Catharina Rudolph ,  Heike Drummer ,  Andre Loebmann ,  Christian Thaldorf

发明人： Catharina Rudolph ,  Heike Drummer ,  Andre Loebmann ,  Christian Thaldorf

IPC分类号： B24B49/00 ,  B24B7/30

CPC分类号： B24B37/013 ,  B24B49/00 ,  H01L21/31053

摘要： The invention relates to a method for monitoring a CMP polishing method, a substrate being fixed in a mount, a polishing pad being fixed on a plate, a surface of the polishing pad being operatively connected to a surface of the substrate, the polishing pad and the substrate being moved relative to one another, so that material is removed from the surface of the substrate. A measuring device is provided, which is operatively connected to the surface of the polishing pad, the measuring device detecting the surface constitution of the polishing pad and generating a measurement signal dependent on the surface constitution of the polishing pad. The measurement signal is compared with corresponding reference values for the purpose of identifying a change in the material of the surface of the substrate during the CMP polishing method.

摘要翻译： 本发明涉及一种用于监测CMP抛光方法的方法，一种固定在底座中的基板，一个固定在板上的抛光垫，该抛光垫的表面可操作地连接到该基板的表面，该抛光垫和 衬底相对于彼此移动，使得材料从衬底的表面移除。 提供测量装置，其可操作地连接到抛光垫的表面，测量装置检测抛光垫的表面结构，并产生取决于抛光垫的表面结构的测量信号。 将测量信号与相应的参考值进行比较，以便在CMP抛光方法中识别基板表面的材料的变化。