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公开(公告)号：US20240301683A1
公开(公告)日：2024-09-12
申请号：US18440332
申请日：2024-02-13
发明人： Yanjia Zuo , Chris L. Heikkinen , John T. Madajewski , Phillip Evans , Chris W. Niemi , Jeremiah L. Shaffer , Isabelle Etchart Randlett , Robert Miller , Keith C. Hong , Zhengzhi Zhou
CPC分类号： E04B1/86 , E04B9/001 , E04B9/0435 , E04B9/241 , E04B9/28 , E04B2001/8461
摘要： The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.
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公开(公告)号：US20210285207A1
公开(公告)日：2021-09-16
申请号：US17201784
申请日：2021-03-15
发明人： Yanjia Zuo , Chris L. Heikkinen , John T. Madajewski , Phillip Evans , Chris W. Niemi , Jeremiah L. Shaffer , Isabelle Etchart Randlett , Robert Miller , Keith C. Hong , Zhengzhi Zhou
摘要： The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.
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公开(公告)号：US11898345B2
公开(公告)日：2024-02-13
申请号：US17201784
申请日：2021-03-15
发明人： Yanjia Zuo , Chris L. Heikkinen , John T. Madajewski , Phillip Evans , Chris W. Niemi , Jeremiah L. Shaffer , Isabelle Etchart Randlett , Robert Miller , Keith C. Hong , Zhengzhi Zhou
CPC分类号： E04B1/86 , E04B9/001 , E04B9/0435 , E04B9/241 , E04B9/28 , E04B2001/8461
摘要： The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.
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