公开(公告)号：US20090139077A1

公开(公告)日：2009-06-04

申请号：US12201490

申请日：2008-08-29

Applicant: Chan-Yong LEE

Inventor： Chan-Yong LEE

IPC: B23P11/00

CPC classification number: B24B37/28 ,  Y10T29/49982

Abstract: Provided is a method of manufacturing a wafer carrier capable of providing good abrasion resistance to remarkably increase lifespan of the wafer carrier, and preventing occurrence of defects from an edge of a wafer during double-sided polishing of the wafer. The method includes machining a carrier body constituting the wafer carrier in a pre-set shape, forming a preliminary hole and a slurry introduction hole in the carrier body of the wafer carrier, coating diamond-like carbon (DLC) on the carrier body having the preliminary hole, and, after coating the DLC, enlarging the preliminary hole to form a wafer retaining hole, into which the wafer is inserted.

Abstract translation: 提供一种制造晶片载体的方法，其能够提供良好的耐磨性，以显着提高晶片载体的寿命，并且在晶片的双面抛光期间防止从晶片边缘发生缺陷。 该方法包括以预定形状加工构成晶片载体的载体，在晶片载体的载体中形成预备孔和浆料引入孔，在载体上涂覆类金刚石碳（DLC），其具有 预备孔，并且在涂覆DLC之后，扩大预备孔以形成晶片插入其中的晶片保持孔。