公开(公告)号：US11772231B2

公开(公告)日：2023-10-03

申请号：US16320841

申请日：2017-05-23

申请人： SUMCO CORPORATION

发明人： Shunsuke Mikuriya ,  Tomonori Miura

IPC分类号： B24B37/28 ,  H01L21/304 ,  B24B37/04 ,  B24B49/00

CPC分类号： B24B37/28 ,  B24B37/042 ,  B24B49/00 ,  H01L21/304

摘要： Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.

公开(公告)号：US20180117729A1

公开(公告)日：2018-05-03

申请号：US15572747

申请日：2016-03-25

申请人： SHIN-ETSU HANDOTAI CO., LTD.

发明人： Taichi YASUDA ,  Masanao SASAKI

IPC分类号： B24B37/08 ,  B24B37/28 ,  H01L21/304

CPC分类号： B24B37/08 ,  B24B37/28 ,  B24B49/00 ,  B24B53/017 ,  H01L21/304

摘要： A workpiece processing apparatus including: a center drum that is rotatable around a rotation axis and has at least one first groove formed in the axial direction on the peripheral surface, a carrier having a holding hole to insert and hold a workpiece to be processed, an upper and lower turn table that are rotatable around the rotation axis in a state wherein the carrier holding workpiece is interposed, at least one hook fitted in the upper turn table's internal circumference, with the tip being inserted into the first groove and movable along first groove; wherein the center drum has at least one second groove formed in the axial direction on peripheral surface, and second groove has a length different from that of the first groove and has a supporting surface to support the hook from below at a position above a position where upper turn table processes the workpiece.

公开(公告)号：US20160189973A1

公开(公告)日：2016-06-30

申请号：US14910803

申请日：2014-06-12

申请人： FUJIMI INCORPORATED

发明人： Makoto TABATA ,  Shinichiro TAKAMI ,  Shogaku IDE

IPC分类号： H01L21/306 ,  C09G1/02

CPC分类号： H01L21/30625 ,  B24B37/28 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/02024

摘要： [Problem] To provide a method for producing a polished object, which can remarkably reduce a haze level on a surface of the object to be polished while defects are significantly reduced.[Solution] A method for producing a polished object, which includes a double-side polishing step in which an object to be polished is subjected to double-side polishing using a double-side polishing composition including first abrasive grains having an average primary particle diameter of 40 nm or more and a nitrogen-containing water-soluble polymer to obtain a double-side polished object; and a single-side polishing step in which the double-side polished object is subjected to single-side polishing using a single-side polishing composition including second abrasive grains having an average primary particle diameter of 40 nm or less and a water-soluble polymer, and in which a ratio of an average primary particle diameter (A) of the first abrasive grains with respect to an average primary particle diameter (B) of the second abrasive grains (A)/(B) is more than 1 and 2.5 or less.

摘要翻译： 本发明提供一种抛光对象的制造方法，其能够显着地降低被抛光体的表面上的雾度，同时缺陷明显减少。 [解决方案]一种抛光对象的制造方法，其包括双面研磨工序，其中使用双面抛光组合物进行双面抛光，其中使用双面抛光组合物，所述双面抛光组合物包括具有平均初级粒径 为40nm以上，含氮水溶性聚合物为双面抛光对象物; 以及使用单平面抛光组合物对双面抛光对象进行单面抛光的单面抛光步骤，该单面抛光组合物包括平均一次粒径为40nm以下的第二磨料颗粒和水溶性聚合物 ，其中第一磨粒的平均一次粒径（A）相对于第二磨粒（A）/（B）的平均一次粒径（B）的比例大于1和2.5或 减。

公开(公告)号：US09299382B2

公开(公告)日：2016-03-29

申请号：US13359011

申请日：2012-01-26

申请人： Hideo Sakai ,  Yoshihiro Tawara

发明人： Hideo Sakai ,  Yoshihiro Tawara

IPC分类号： B24B37/28 ,  G11B5/84 ,  B24B7/22

CPC分类号： G11B5/8404 ,  B24B7/228 ,  B24B37/28

摘要： A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.

摘要翻译： 一种制造用于磁盘的玻璃基板的方法包括：抛光步骤，通过将玻璃基板夹在其表面上具有抛光垫的一对表面板之间，并且通过供给包含 在玻璃基板和抛光垫之间抛光研磨颗粒。 在研磨工序中，调整研磨液和各研磨垫，摩擦系数在0.02〜0.05的范围内。

公开(公告)号：US20150321311A1

公开(公告)日：2015-11-12

申请号：US14652260

申请日：2013-12-19

申请人： SHIN-ETSU HANDOTAI CO., LTD.

发明人： Masanao SASAKI ,  Isao UCHIYAMA

IPC分类号： B24B37/28 ,  B24B37/08

CPC分类号： B24B37/28 ,  B24B37/08

摘要： A method provides a carrier used in a double-side polishing apparatus such that the carrier is disposed between upper and lower turn tables to which polishing pads are attached in the double-side polishing apparatus and holds a wafer interposed between the upper and lower turn tables in a holding hole formed in the carrier during polishing, including upper and lower main surface portions composed of a β-titanium alloy obtained from pure titanium containing 0.5 weight % or more of a β-stabilizing element. The carrier has a high abrasion resistance and can reduce its cost.

摘要翻译： 一种方法提供了一种在双面抛光装置中使用的载体，使得载体设置在双面抛光装置中安装有抛光垫的上下匝台之间，并保持夹在上下匝台之间的晶片 在抛光期间形成在载体中的保持孔中，包括由含有0.5重量％以上的稳定元素的纯钛得到的由钛合金组成的上主表面部分和下主表面部分。 载体具有高耐磨性并且可以降低其成本。

公开(公告)号：US20150147944A1

公开(公告)日：2015-05-28

申请号：US14405326

申请日：2013-06-03

申请人： SHIN-ETSU HANDOTAI CO., LTD.

发明人： Kenji Kobayashi

IPC分类号： B24B41/06 ,  B24B7/22 ,  B24B7/17

CPC分类号： B24B41/067 ,  B24B7/17 ,  B24B7/228 ,  B24B37/08 ,  B24B37/28

摘要： The invention is directed to a double-disc grinding apparatus including: a rotatable ring holder configured to support a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece; a pair of grinding wheels for grinding surfaces of the workpiece supported by the ring holder; and a hydrostatic bearing for supporting the ring holder without contact from both of a direction of a rotational axis of the ring holder and a direction perpendicular to the rotational axis by hydrostatic pressure of fluid supplied from both directions, wherein supply pressures at which the fluid is supplied from the direction of the rotational axis and from the direction perpendicular to the rotational axis can be independently controlled. The invention provides a double-disc grinding apparatus and a workpiece double-disc grinding method that can improve variation in nanotopography depending on the lot of workpieces or grinding wheels to obtain nanotopography stably.

摘要翻译： 本发明涉及一种双盘磨削装置，包括：可旋转环保持器，其被构造成从工件的外周侧沿圆周方向支撑片材工件; 一对砂轮，用于研磨由所述环形支架支撑的所述工件的表面; 以及静压轴承，用于通过从两个方向供应的流体的流体静力压力来支撑环形支架而不受到环形支架的旋转轴线的方向和垂直于旋转轴线的方向的接触，其中流体为 可以独立地控制从旋转轴线的方向和从旋转轴线垂直的方向供给。 本发明提供一种双盘磨削装置和工件双盘磨削方法，其可以根据工件或砂轮的数量来改善纳米形貌的变化以获得稳定的纳米形貌。

公开(公告)号：US08926400B2

公开(公告)日：2015-01-06

申请号：US13414568

申请日：2012-03-07

申请人： Neale M. Jones ,  Kurt A. Rubin

发明人： Neale M. Jones ,  Kurt A. Rubin

IPC分类号： B24B1/00 ,  B24B5/02 ,  B24B5/313

CPC分类号： B24B37/28

摘要： An apparatus, system, and method are provided for reducing edge damage of a disk during chemical mechanical polishing. The apparatus includes a disk carrier configured to receive a disk, the disk having an outside edge and an inside edge, a raised ring adjacent the outside edge of the disk and extending from a surface of the disk carrier to a height greater than a height of the disk, and a raised column adjacent the inside edge of the disk and having a height greater than a height of the disk. The system includes a disk carrier for receiving a disk, a raised ring adjacent the outside edge of each opening, and plugs insertable into a central opening in the disk and having a height greater than a height of the disk. The method includes providing the apparatus, inserting a disk into the apparatus, and polishing the disk.

摘要翻译： 提供了一种用于在化学机械抛光期间减少盘的边缘损伤的装置，系统和方法。 该装置包括：盘载体，其构造成接收盘，盘具有外边缘和内边缘;邻近盘的外边缘并从盘托架的表面延伸到高于高度 盘和与盘的内边缘相邻并具有大于盘的高度的高度的升高的列。 该系统包括用于接收盘的盘载体，与每个开口的外边缘相邻的凸起环，以及可插入盘中的中心开口并且具有高于盘的高度的高度的插塞。 该方法包括提供装置，将盘插入设备中，并抛光盘。

公开(公告)号：US08801500B2

公开(公告)日：2014-08-12

申请号：US13313114

申请日：2011-12-07

申请人： Georg Pietsch

发明人： Georg Pietsch

IPC分类号： B24B1/00 ,  B24B7/17 ,  B24B7/22

CPC分类号： B24B7/17 ,  B24B7/228 ,  B24B37/08 ,  B24B37/28 ,  H01L21/02013 ,  H01L21/02024

摘要： A method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers includes providing a double-side processing apparatus including two rotating ring-shaped working disks and a rolling apparatus. The carriers are arranged in the double-side processing apparatus and the openings are disposed in the carriers so as to satisfy the inequality: R/e·sin(π/N*)−r/e−1≦1.2 where N* denotes a ratio of the round angle and an angle at which adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect to one another, r denotes a radius of each opening for receiving a respective semiconductor wafer, e denotes a radius of a pitch circle around a midpoint of the carrier on which the opening is arranged, and R denotes a radius of the pitch circle on which the carriers move between the working disks by means of the rolling apparatus.

摘要翻译： 至少三个半导体晶片的两侧的同时进行材料去除处理的方法包括提供包括两个旋转环形工作盘和滚动装置的双面处理设备。 载体布置在双面处理装置中，并且开口设置在载体中以满足不等式：R / e·sin（＆pgr; / N *）-r / e-1＆nlE; 1.2其中N *表示 相邻载体相对于彼此以最大距离插入到滚动装置中的角度和角度的比率，r表示用于接收各个半导体晶片的每个开口的半径，e表示间距的半径 围绕其上布置有开口的载体的中点周围，并且R表示载体在工作盘之间借助于滚动装置移动的节圆的半径。

公开(公告)号：US08712575B2

公开(公告)日：2014-04-29

申请号：US13049536

申请日：2011-03-16

申请人： Sumeet S. Bhagavat ,  Roland R. Vandamme ,  Tomomi Komura

发明人： Sumeet S. Bhagavat ,  Roland R. Vandamme ,  Tomomi Komura

IPC分类号： B24B1/00 ,  H01L21/00 ,  B24B9/14 ,  H01L21/78 ,  B24B37/04

CPC分类号： B24B9/148 ,  B24B37/042 ,  B24B37/08 ,  B24B37/28 ,  B24B49/00 ,  H01L21/78

摘要： Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer.

摘要翻译： 公开了用于调节具有一对砂轮的双面晶圆研磨机中的静水压力的系统和方法。 系统和方法使用处理器来测量由砂轮吸取的电流量。 模式检测软件用于基于测量的电流来预测磨削阶段。 在每个阶段通过流量控制阀改变静水压力，以改变施加到晶片的夹紧压力，从而改善加工晶片中的纳米拓扑。

公开(公告)号：US20130084783A1

公开(公告)日：2013-04-04

申请号：US13611110

申请日：2012-09-12

申请人： Tomohide Jozaki ,  Shunsuke Matsui

发明人： Tomohide Jozaki ,  Shunsuke Matsui

IPC分类号： B24B37/27 ,  B24B37/07

CPC分类号： B24B37/08 ,  B24B7/17 ,  B24B13/015 ,  B24B37/28

摘要： There is provided a grinding apparatus including: an upper surface plate; a lower surface plate disposed facing the upper surface plate and rotating in an opposite direction to the upper surface plate; a sun gear rotated by a same rotational shaft as the upper surface plate and the lower surface plate; an internal gear rotated by the same rotational shaft as the upper surface plate and the lower surface plate; and a planetary carrier in which a holding hole that holds a workpiece is formed and which revolves while rotating in engagement with the sun gear and the internal gear. The holding hole in the planetary carrier is provided with a cutaway in a side of the holding hole that contacts a side surface of the workpiece when the planetary carrier rotates.

摘要翻译： 提供了一种研磨装置，包括：上表面板; 下表面板，设置成面向上表面板并且沿与上表面板相反的方向旋转; 由与上表面板和下表面板相同的旋转轴旋转的太阳齿轮; 由与上表面板和下表面板相同的旋转轴旋转的内齿轮; 以及行星架，其中形成有保持工件的保持孔，并且与星形齿轮和内齿轮接合旋转。 行星架上的保持孔在行星齿轮架旋转时在保持孔的与侧面相接触的一侧设置有切口。