Methods of forming integrated circuit devices using modified rectangular mask patterns to increase reliability of contacts to electrically conductive lines
    1.
    发明授权
    Methods of forming integrated circuit devices using modified rectangular mask patterns to increase reliability of contacts to electrically conductive lines 有权
    使用改进的矩形掩模图案形成集成电路器件以提高与导电线的接触的可靠性的方法

    公开(公告)号:US08796134B2

    公开(公告)日:2014-08-05

    申请号:US13397038

    申请日:2012-02-15

    IPC分类号: H01L21/4763 H01L21/302

    CPC分类号: H01L21/32139 H01L21/0274

    摘要: Methods of forming integrated circuit devices include forming first and second electrically conductive lines at side-by-side locations on an integrated circuit substrate. Steps are performed to selectively etch each of the first and second electrically conductive lines into a respective pair of interconnects having facing ends that are separated from each other. This selective etching step is performed using a photolithography mask having a modified-rectangular mask pattern thereon, which is configured to define a shape of the facing ends of each of the pair of interconnects.

    摘要翻译: 形成集成电路器件的方法包括在集成电路衬底上的并排位置形成第一和第二导电线。 执行步骤以选择性地将第一和第二导电线中的每一个蚀刻成具有彼此分离的具有相对端的相应的一对互连。 该选择性蚀刻步骤使用其上具有改变的矩形掩模图案的光刻掩模进行,其被配置为限定该对互连中的每一个的相对端的形状。

    METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING MODIFIED RECTANGULAR MASK PATTERNS TO INCREASE RELIABILITY OF CONTACTS TO ELECTRICALLY CONDUCTIVE LINES
    2.
    发明申请
    METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING MODIFIED RECTANGULAR MASK PATTERNS TO INCREASE RELIABILITY OF CONTACTS TO ELECTRICALLY CONDUCTIVE LINES 有权
    使用改进的矩形掩模图形成集成电路设备的方法来提高联系人对导电线路的可靠性

    公开(公告)号:US20130210223A1

    公开(公告)日:2013-08-15

    申请号:US13397038

    申请日:2012-02-15

    IPC分类号: H01L21/768

    CPC分类号: H01L21/32139 H01L21/0274

    摘要: Methods of forming integrated circuit devices include forming first and second electrically conductive lines at side-by-side locations on an integrated circuit substrate. Steps are performed to selectively etch each of the first and second electrically conductive lines into a respective pair of interconnects having facing ends that are separated from each other. This selective etching step is performed using a photolithography mask having a modified-rectangular mask pattern thereon, which is configured to define a shape of the facing ends of each of the pair of interconnects.

    摘要翻译: 形成集成电路器件的方法包括在集成电路衬底上的并排位置形成第一和第二导电线。 执行步骤以选择性地将第一和第二导电线中的每一个蚀刻成具有彼此分离的具有相对端的相应的一对互连。 该选择性蚀刻步骤使用其上具有改变的矩形掩模图案的光刻掩模进行,其被配置为限定该对互连中的每一个的相对端的形状。

    Method and Apparatus for Analyzing Signal Pattern of Sensor Array
    3.
    发明申请
    Method and Apparatus for Analyzing Signal Pattern of Sensor Array 审中-公开
    用于分析传感器阵列信号模式的方法和装置

    公开(公告)号:US20080052010A1

    公开(公告)日:2008-02-28

    申请号:US11778729

    申请日:2007-07-17

    IPC分类号: G01N33/00 G06F19/00

    CPC分类号: G01N33/0034

    摘要: An aspect of the present invention features a method for analyzing a signal pattern detected by a sensor array that comprises one or more gas sensors. The method can comprises converting multidimensional data outputted from the sensor array to linear data, the data containing information on one or more reference gases; creating an ADSTM (Angle Difference-based State Transition Model) by using the converted data; and analyzing a gas by using the ADSTM when the sensor array outputs data of the gas. The method for analyzing a signal pattern detected by a sensor array according to the present invention can convert multidimensional values inputted through the sensor array into a single piece of continous data.

    摘要翻译: 本发明的一个方面的特征在于一种用于分析由包括一个或多个气体传感器的传感器阵列检测到的信号图案的方法。 该方法可以包括将从传感器阵列输出的多维数据转换为线性数据,该数据包含关于一个或多个参考气体的信息; 通过使用转换的数据创建ADSTM(基于角度差异的状态转换模型); 并且当传感器阵列输出气体的数据时,通过使用ADSTM来分析气体。 根据本发明的用于分析由传感器阵列检测的信号图案的方法可以将通过传感器阵列输入的多维值转换为单个连续数据。