摘要:
A manufacturing process for a keypad module includes the steps of: providing an opaque layer, one side of the opaque layer having symbol regions; providing a mold formed thereon with a planar recession and a plurality of pits for forming keys; injecting a gel-like ultraviolet curable resin into the planar recession and pits of the mold; adhering the surface of the opaque layer having the symbol regions on the planar recession of the mold so as to contact the ultraviolet curable resin; irradiating the mold with an ultraviolet light so as to cure the ultraviolet curable resin; and taking out the opaque layer and the cured ultraviolet curable resin to obtain a keypad module.
摘要:
A method for manufacturing a metallic panel having multilayer arrays of micropores includes the steps of: preparing a metallic thin plate first; forming a plurality of micropores and hollowed portions on the metallic thin plate with the hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a multilayer backlight module is arranged on one side surface of the metallic panel via a hot pressing or adhering process. Finally, a telecommunication module is adhered on one side surface of the backlight module. In this way, the metallic panel having multilayer arrays of micropores can be completed.
摘要:
A keypad panel assembly having arrays of micropores includes a panel body, a shielding layer, a backlight module, and a telecommunication module. The panel body is formed into a plate. The shielding layer is provided on one surface of the panel body. A plurality of micropores are formed on the shielding layer. The micropores are arranged to form patterns for pressing. The backlight module is arranged on one surface of the shielding layer. The telecommunication module is arranged on one surface of the backlight module. When a set of light-emitting units is lighted up, the light enters one end of a light-guiding plate. The light is reflected by light-guiding microstructures onto the corresponding key, so that the user can see the position of each key clearly.
摘要:
A metallic panel assembly having multilayer arrays of micropores includes a backlight module and a panel body. The backlight module is constituted of a first and a second light-guiding plate. First and second light-guiding microstructures are provided on the first and second light-guiding plates. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. The panel body is disposed on one side surface of the first light-guiding plate. The panel body has thereon a plurality of hollowed portions with the hollowed portions encircling a key body. The key body has thereon a plurality of micropores. The plurality of micropores is arranged to form a pattern of each key body. When the first or second set of light-emitting units are lighted up, the light enters one side of the first or second light-guiding plate. The light is reflected by the first or second light-guiding microstructures on the corresponding key panel, so that the user can see the position of each key clearly.
摘要:
A process for keycaps includes the steps of: providing a light-transmitting material; making the light-transmitting material into a keycap body, the keycap body having a light-entering surface, one side of the light-entering surface extending to form a light-exiting surface intersecting with the light-entering surface, a connecting surface being formed between the light-entering surface and the light-exiting surface; and coating a light-shielding layer on the connecting surface to form a light-reflecting surface in the light-shielding layer. Via the above process, a keycap that guides light laterally can be obtained.
摘要:
A metallic panel assembly having multilayer arrays of micropores includes a backlight module and a panel body. The backlight module is constituted of a first and a second light-guiding plate. First and second light-guiding microstructures are provided on the first and second light-guiding plates. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. The panel body is disposed on one side surface of the first light-guiding plate. The panel body has thereon a plurality of hollowed portions with the hollowed portions encircling a key body. The key body has thereon a plurality of micropores. The plurality of micropores is arranged to form a pattern of each key body. When the first or second set of light-emitting units are lighted up, the light enters one side of the first or second light-guiding plate. The light is reflected by the first or second light-guiding microstructures on the corresponding key panel, so that the user can see the position of each key clearly.
摘要:
A keypad module includes a non-backlight layer made of an opaque thin sheet, and a key layer made of an ultraviolet curable resin. One surface of the non-backlight layer is provided thereon with a recognition region. The key layer has a base portion and a plurality of pressing portions protruding from the base portion. The base portion is overlapped with and bonded to the surface of the non-backlight layer on which the recognition region is provided. Each of the pressing portions is arranged to correspond to the recognition region. The panel further includes a telecommunication module located below the keypad module.
摘要:
A keypad module includes a non-backlight layer made of an opaque thin sheet, and a key layer made of an ultraviolet curable resin. One surface of the non-backlight layer is provided thereon with a recognition region. The key layer has a base portion and a plurality of pressing portions protruding from the base portion. The base portion is overlapped with and bonded to the surface of the non-backlight layer on which the recognition region is provided. Each of the pressing portions is arranged to correspond to the recognition region. The panel further includes a telecommunication module located below the keypad module.
摘要:
A process for a keypad panel having arrays of micropores includes the steps as follows. First, a plastic thin plate is prepared. A shielding layer is formed on one surface of the plastic thin plate. A plurality of micropores is formed on the shielding layer via an etching process. The micropores are arranged to form patterns for pressing. Then, the plastic thin plate is cut to form a keypad panel of a predetermined shape. A backlight module is adhered on one surface of the shielding layer. A telecommunication module is arranged on one surface of the backlight module. When a set of light-emitting units are lighted up, the light enters one end of a light-guiding plate. The light is reflected by light-guiding microstructures onto the corresponding key, so that the user can see the position of each key clearly.
摘要:
A keycap is made of a light-transmitting material. The bottom of the keycap has a light-entering surface. A light-exiting surface extends from one side of the light-entering surface and intersects therewith. A connecting surface is formed between the light-entering surface and the light-exiting surface. The connecting surface is covered by a light-shielding layer. A light-reflecting surface is formed in the light-shielding layer. The light is introduced from the light-entering surface and reflected by the reflecting surface so as to project toward the light-exiting surface. The keypad panel is constituted of the above-mentioned keycap.