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    BEZEL PACKAGING FOR SEALED GLASS ASSEMBLIES AND A GLASS ASSEMBLY THEREFOR
    3.
    发明申请
    BEZEL PACKAGING FOR SEALED GLASS ASSEMBLIES AND A GLASS ASSEMBLY THEREFOR 有权
    密封玻璃组件的贝类包装及其玻璃组件

    公开(公告)号：US20110019351A1

    公开(公告)日：2011-01-27

    申请号：US12922987

    申请日：2009-03-30

    申请人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

    发明人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

    IPC分类号： H05K7/00 ,  H01J5/02

    CPC分类号： G02F1/133308 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/5237

    摘要： Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.

    摘要翻译： 与密封玻璃组件的框架或边框包装相关的方法和组件，例如适合密封的OLED装置，例如OLED显示面板。 框架或边框包装可以具有（a）圆形或倒角的一个或多个，（a）盖，（b）加强的引线边缘，（c）后面板中的开口或切口以节省材料并减轻边框 ，和（d）在密封的玻璃组件和框架或表圈的背面和/或侧面之间施加低弹性材料材料的吸震中间层。 框架或边框设计可以包括密封的玻璃组件和边框的后面板之间的间隙。 间隙可以至少部分地用低弹性背衬材料填充。 玻璃包装可以具有一个或多个（a）圆形或倒角，（b）圆形或倒角边缘，（c）围绕其周边或其周边部分施加的低弹性材料，例如仅在拐角上 ，（d）缩短的引线端，（e）增厚的引线端。

    Process for producing electroluminescent phosphor with increased efficiency
    5.
    发明授权
    Process for producing electroluminescent phosphor with increased efficiency 失效
    具有提高效率的电致发光荧光体的制造方法

    公开(公告)号：US06387299B1

    公开(公告)日：2002-05-14

    申请号：US09630400

    申请日：2000-08-02

    申请人： Butchi Reddy Vaddi ,  Shellie K. Northrop

    发明人： Butchi Reddy Vaddi ,  Shellie K. Northrop

    IPC分类号： C09K1156

    CPC分类号： C09K11/612

    摘要： An electroluminescent phosphor with an increased efficiency is created by blending a chloride flux, a copper source and a zinc sulfide to form a mixture and then heating the mixture for a period of time, cooling the mixture, and washing it with de-ionized water. The mixture is dried and milled to form cubic ZnS from hexagonal ZnS, forming a beginning uncoated ZnS:Cu,Cl electroluminescent phosphor. This beginning phosphor is added to other materials, including Ga2O3, forming a second step material (SSM). The SSM is placed into a first vessel, such as a plastic bottle, blended, sifted and then placed in a second inert reaction vessel that is then heated for a period of time. After cooling, the fired SSM is washed with de-ionized water, washed with acetic acid, again washed with de-ionized water to remove residual acid, washed with KCN and again with de-ionized water to remove residual KCN. The fired and washed SSM is then dried, filtered and sifted, producing a new phosphor with an increased efficiency.

    摘要翻译： 通过混合氯化物助熔剂，铜源和硫化锌以形成混合物，然后将混合物加热一段时间，冷却混合物，并用去离子水洗涤，产生效率提高的电致发光磷光体。 将混合物干燥并研磨以从六方ZnS形成立方ZnS，形成最初的未涂覆的ZnS：Cu，Cl电致发光磷光体。 将这种起始的磷光体添加到其它材料中，包括形成第二步骤材料（SSM）的Ga 2 O 3。 将SSM放入第一容器中，例如塑料瓶，混合，筛分，然后置于第二惰性反应容器中，然后将其加热一段时间。 冷却后，用去离子水洗涤烧制的SSM，用乙酸洗涤，再次用去离子水洗涤以除去残留的酸，用KCN再次用去离子水洗涤以除去残留的KCN。 然后将烧制和洗涤的SSM干燥，过滤并筛分，产生效率提高的新型磷光体。

    Method for hermetically sealing an OLED display
    6.
    发明申请
    Method for hermetically sealing an OLED display 审中-公开
    密封OLED显示器的方法

    公开(公告)号：US20080048556A1

    公开(公告)日：2008-02-28

    申请号：US11509447

    申请日：2006-08-24

    申请人： Stephan Lvovich Logunov ,  Kamjula Pattabhirami Reddy ,  Butchi Reddy Vaddi

    发明人： Stephan Lvovich Logunov ,  Kamjula Pattabhirami Reddy ,  Butchi Reddy Vaddi

    IPC分类号： H01J1/62 ,  H01J63/04

    CPC分类号： H01L51/5246 ,  H01L51/0096

    摘要： A top emission, organic light emitting diode display comprises an organic light emitting diode (OLED), a first substrate having an inner surface, and a second substrate having an inner surface, wherein the OLED is sandwiched between the first substrate and the second substrate. At least one of the first substrate and the second substrate includes a pocket formed in the inner surface thereof having a depth such that a distance between the inner surface of the first substrate and the inner surface of the second substrate sufficient to reduce or eliminate the formation of optical distortions such as Newton rings in the display. Other embodiments of the display comprise a frit located between the first and second substrates having a thickness such that the distance between the inner surfaces of the first and second substrates is great enough to prevent the formation of Newton rings.

    摘要翻译： 顶部发射的有机发光二极管显示器包括有机发光二极管（OLED），具有内表面的第一衬底和具有内表面的第二衬底，其中OLED被夹在第一衬底和第二衬底之间。 第一基板和第二基板中的至少一个包括形成在其内表面中的凹部，其具有使得第一基板的内表面与第二基板的内表面之间的距离足以减少或消除形成的深度 的光学失真，例如显示器中的牛顿环。 显示器的其它实施例包括位于第一和第二基板之间的玻璃料，其厚度使得第一和第二基板的内表面之间的距离足够大以防止形成牛顿环。

    Electroluminescent phosphor with high brightness
    7.
    发明授权
    Electroluminescent phosphor with high brightness 失效
    高亮度电致发光荧光粉

    公开(公告)号：US06214257B1

    公开(公告)日：2001-04-10

    申请号：US09327029

    申请日：1999-06-07

    申请人： Butchi Reddy Vaddi

    发明人： Butchi Reddy Vaddi

    IPC分类号： C09K1154

    CPC分类号： C09K11/612 ,  C09K11/08

    摘要： A method of increasing the brightness of an electroluminescent phosphor comprises the steps of forming the phosphor as a base phosphor to have a given brightness; and annealing the base phosphor at a temperature and for a time sufficient to increase the given brightness of the base phosphor and form an annealed phosphor. Brightness can be increased from 8% to about 33% when measure against a control made by the same process but not annealed.

    摘要翻译： 增加电致发光荧光体的亮度的方法包括以下步骤：形成具有给定亮度的基底荧光体的荧光体; 并在足以增加基底荧光粉的给定亮度的温度和时间下退火基底荧光体，并形成退火的荧光体。 当对相同工艺进行的控制进行测量而不退火时，亮度可以从8％提高到约33％。

    Bezel packaging for sealed glass assemblies and a glass assembly therefor
    8.
    发明授权
    Bezel packaging for sealed glass assemblies and a glass assembly therefor 有权
    密封玻璃组件的挡板包装及其玻璃组件

    公开(公告)号：US08885116B2

    公开(公告)日：2014-11-11

    申请号：US12922987

    申请日：2009-03-30

    申请人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

    发明人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

    IPC分类号： G02F1/1333 ,  H01L51/52

    CPC分类号： G02F1/133308 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/5237

    摘要： Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.

    摘要翻译： 与密封玻璃组件的框架或边框包装相关的方法和组件，例如适合密封的OLED装置，例如OLED显示面板。 框架或边框包装可以具有（a）圆形或倒角的一个或多个，（a）盖，（b）加强的引线边缘，（c）后面板中的开口或切口以节省材料并减轻边框 ，和（d）在密封的玻璃组件和框架或表圈的背面和/或侧面之间施加低弹性材料材料的吸震中间层。 框架或边框设计可以包括密封的玻璃组件和边框的后面板之间的间隙。 间隙可以至少部分地用低弹性背衬材料填充。 玻璃包装可以具有一个或多个（a）圆形或倒角，（b）圆形或倒角边缘，（c）围绕其周边或其周边部分施加的低弹性材料，例如仅在拐角上 ，（d）缩短的引线端，（e）增厚的引线端。