公开(公告)号：US20080225088A1

公开(公告)日：2008-09-18

申请号：US12076146

申请日：2008-03-14

申请人： Chen-Kuei Chung ,  Yi-Zhi Hong

发明人： Chen-Kuei Chung ,  Yi-Zhi Hong

IPC分类号： B41J2/05 ,  G11B5/127

CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/1639 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2202/13

摘要： A fluid jet device and a method for manufacturing the same are provided. The fluid jet device includes a substrate, a resistor layer and an orifice layer. The resistor layer is formed on the substrate. The resistor layer includes tantalum, silicon and nitrogen. The orifice layer is disposed on over the substrate to form a manifold between the orifice layer and the substrate. The manifold is used for containing a fluid. The orifice layer has a nozzle communicated with to the manifold. When the resistor layer is charged, the resistor layer heats the adjacent fluid to generate a bubble therein so as to allow the fluid to be pushed out of the nozzle.

摘要翻译： 提供一种流体喷射装置及其制造方法。 流体喷射装置包括基底，电阻层和孔层。 电阻层形成在基板上。 电阻层包括钽，硅和氮。 孔层设置在基板上方，以在孔板和基板之间形成歧管。 歧管用于容纳流体。 孔口层具有与歧管连通的喷嘴。 当电阻层被充电时，电阻层加热相邻的流体以在其中产生气泡，从而允许流体被推出喷嘴。