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    Method for fabricating a thermal bubble inkjet print head with rapid ink refill mechanism and off-shooter heater
    1.
    发明申请
    Method for fabricating a thermal bubble inkjet print head with rapid ink refill mechanism and off-shooter heater 有权
    用快速墨水补充机构和离枪加热器制造热气泡喷墨打印头的方法

    公开(公告)号：US20060158483A1

    公开(公告)日：2006-07-20

    申请号：US11315567

    申请日：2005-12-22

    申请人： Chung-Chu Chen ,  Chen-Kuei Chung ,  Chun-Jun Lin

    发明人： Chung-Chu Chen ,  Chen-Kuei Chung ,  Chun-Jun Lin

    IPC分类号： B41J2/14

    CPC分类号： B41J2/1642 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1625 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1643 ,  B41J2/1645 ,  Y10T29/49401

    摘要： A method for fabricating a thermal inkjet head equipped with symmetrical heaters and a rapid ink refill mechanism and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist deposition process is carried out to form a primary ink chamber and an auxiliary ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel electroplating process provides an orifice plate on top of the inkjet head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.

    摘要翻译： 提供了一种制造装备有对称加热器和快速墨水补充机构的热喷墨头的方法以及通过该方法制造的头部。 该方法包括两个厚的光致抗蚀剂沉积工艺和镍电镀工艺。 进行第一厚的光致抗蚀剂沉积工艺以形成与漏斗形歧管和喷射器孔口流体连通的初级墨水室和辅助墨水室。 第二厚的光致抗蚀剂沉积工艺形成用于形成通向喷射孔的喷射器通道的模具。 镍电镀工艺在喷墨头的顶部提供孔板，通过该孔板提供通向喷射器孔口的喷射器通道用于喷射墨滴。

    Integrated micro-droplet generator
    3.
    发明授权
    Integrated micro-droplet generator 失效
    集成微滴发生器

    公开(公告)号：US06942320B2

    公开(公告)日：2005-09-13

    申请号：US10057025

    申请日：2002-01-24

    申请人： Chen-Kuei Chung ,  Chun-Jun Lin ,  Chung-Chu Chen

    发明人： Chen-Kuei Chung ,  Chun-Jun Lin ,  Chung-Chu Chen

    IPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/05

    CPC分类号： B41J2/1645 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1625 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2/1643 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49401

    摘要： A method for fabricating a thermal inkjet head equipped with a symmetrical heater and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist deposition process is carried out to form an ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel electroplating process provides an orifice plate on top of the inkjet head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.

    摘要翻译： 提供一种制造配备有对称加热器的热喷墨头和通过该方法制造的头的方法。 该方法包括两个厚的光致抗蚀剂沉积工艺和镍电镀工艺。 进行第一厚的光致抗蚀剂沉积工艺以形成与漏斗形歧管和喷射器孔流体连通的墨室。 第二厚的光致抗蚀剂沉积工艺形成用于形成通向喷射孔的喷射器通道的模具。 镍电镀工艺在喷墨头的顶部提供孔板，通过该孔板提供通向喷射器孔口的喷射器通道用于喷射墨滴。

    Microfluid driving device
    4.
    发明授权
    Microfluid driving device 失效
    微流体驱动装置

    公开(公告)号：US06743636B2

    公开(公告)日：2004-06-01

    申请号：US09863332

    申请日：2001-05-24

    申请人： Chen-Kuei Chung ,  Wei-Jieh Chang ,  Chieh-Ling Hsiao ,  Kuo-Yao Weng

    发明人： Chen-Kuei Chung ,  Wei-Jieh Chang ,  Chieh-Ling Hsiao ,  Kuo-Yao Weng

    IPC分类号： B01L302

    CPC分类号： F04F5/54 ,  B01F13/0059 ,  B01F15/0248 ,  B01F15/0284 ,  B01L3/50273 ,  B01L2400/0463 ,  B01L2400/0487 ,  F04B19/006 ,  Y10T436/15 ,  Y10T436/25 ,  Y10T436/2575

    摘要： A microfluid driving device is provided. The microfluid driving device of this invention comprises microfluid driving platform prepared in a chip, which platform comprises at least two miniature Venturi pumps, at least one microchannel and optionally micro mixers or micro reactors in said microchannel; an external pneumatic flow supply and control module that provides selectively different air flows; and an interface device connecting said microfluid driving platform and said external pneumatic flow supply and control module. The air flows supplied by said the pneumatic flow supply and control module are supplied under selected flow rates and frequencies to said at least two Venturi pumps through said interface device, such that the microfluid inside said microchannel may be driven forward or backward or halt and the transportation, mixing and reaction of the microfluid may be accomplished.

    摘要翻译： 提供微流体驱动装置。 本发明的微流体驱动装置包括在芯片中制备的微流体驱动平台，该平台包括至少两个微型文丘里泵，所述微通道中的至少一个微通道和任选的微混合器或微反应器; 提供选择性地不同气流的外部气流供应和控制模块; 以及连接所述微流体驱动平台和所述外部气动流量供给和控制模块的接口装置。 由所述气流供应和控制模块供应的空气流通过所述接口装置以选定的流量和频率供应到所述至少两个文丘里泵，使得所述微通道内的微流体可以向前或向后或向后或停止， 可以实现微流体的运输，混合和反应。

    Anisotropic wet etching
    5.
    发明授权
    Anisotropic wet etching 有权
    各向异性湿蚀刻

    公开(公告)号：US06395645B1

    公开(公告)日：2002-05-28

    申请号：US09137446

    申请日：1998-08-06

    申请人： Chen-Kuei Chung ,  Chien-Chih Lee ,  Ching-Yi Wu

    发明人： Chen-Kuei Chung ,  Chien-Chih Lee ,  Ching-Yi Wu

    IPC分类号： H01L21302

    CPC分类号： H01L21/30608 ,  H01L21/3083

    摘要： A method for anisotropic wet etching is disclosed. In to this invention, a photo mask for the etching mask suited in the anisotropic wet etching is provided. In the photo mask, a pattern with a series of adjacent corners having a substantially rectangular, angle is formed. At the corner areas compensational patterns comprising masked grids are prepared. The pattern on the photo mask is then transferred to an etching mask of a semiconductor substrate such that a multi-level terrace structure with fine corners may be prepared during the etching of the substrate. The method of this invention is also applicable to semiconductor materials with the same diamond structure as that of silicon.

    摘要翻译： 公开了一种用于各向异性湿蚀刻的方法。 在本发明中，提供了适用于各向异性湿蚀刻中的蚀刻掩模用光掩模。 在光掩模中，形成具有大致矩形角的一系列相邻角的图案。 在拐角处，准备包括掩蔽网格的补偿图案。 然后将光掩模上的图案转移到半导体衬底的蚀刻掩模，使得可以在蚀刻基板期间制备具有细角的多层平台结构。 本发明的方法也适用于具有与硅相同的金刚石结构的半导体材料。

    Marking CO2 laser-transparent materials by using absorption-material-assisted laser processing
    6.
    发明授权
    Marking CO2 laser-transparent materials by using absorption-material-assisted laser processing 有权
    使用吸收材料辅助激光加工标记CO2激光透明材料

    公开(公告)号：US08557715B2

    公开(公告)日：2013-10-15

    申请号：US12839186

    申请日：2010-07-19

    申请人： Chen-Kuei Chung ,  Meng-Yu Wu ,  En-Jou Hsiao ,  Shih-Lung Lin

    发明人： Chen-Kuei Chung ,  Meng-Yu Wu ,  En-Jou Hsiao ,  Shih-Lung Lin

    IPC分类号： H01L21/31

    CPC分类号： H01L23/544 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/50 ,  B41M5/262 ,  B41M5/267 ,  H01L21/67282 ,  H01L21/6835 ,  H01L2223/54406 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T428/24802 ,  Y10T428/24917 ,  H01L2924/00

    摘要： The present invention relates to a CO2 laser-transparent material having a mark on the surface thereof and the method for making the same. The method includes the following steps: providing a first substrate, which has a top surface and a bottom surface; providing a second substrate which has a top surface; putting the bottom surface of the first substrate on the top surface of the second substrate; irradiating a CO2 laser beam to the top surface of the second substrate by passing through the top surface and the bottom surface of the first substrate; and forming a mark on the bottom surface of the first substrate. The material of the mark is oxide of the second substrate or the same as the material of the second substrate. Whereby the cheap CO2 laser is utilized to form the mark on the first substrate, and the mark can be erased easily by a proper chemical for recycling the first substrate.

    摘要翻译： 本发明涉及一种在其表面具有标记的CO 2激光透明材料及其制造方法。 该方法包括以下步骤：提供具有顶表面和底表面的第一基底; 提供具有顶表面的第二基底; 将第一衬底的底表面放置在第二衬底的顶表面上; 通过穿过第一基板的顶表面和底表面将CO 2激光束照射到第二基板的顶表面; 并在第一基板的底面上形成标记。 标记的材料是第二衬底的氧化物或与第二衬底的材料相同的材料。 由此利用廉价的CO2激光器在第一基板上形成标记，并且可以通过适当的化学品容易地擦除标记以再循环第一基板。

    Fluid jet device and method for manufacturing the same
    8.
    发明申请
    Fluid jet device and method for manufacturing the same 审中-公开
    流体喷射装置及其制造方法

    公开(公告)号：US20080225088A1

    公开(公告)日：2008-09-18

    申请号：US12076146

    申请日：2008-03-14

    申请人： Chen-Kuei Chung ,  Yi-Zhi Hong

    发明人： Chen-Kuei Chung ,  Yi-Zhi Hong

    IPC分类号： B41J2/05 ,  G11B5/127

    CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/1639 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2202/13

    摘要： A fluid jet device and a method for manufacturing the same are provided. The fluid jet device includes a substrate, a resistor layer and an orifice layer. The resistor layer is formed on the substrate. The resistor layer includes tantalum, silicon and nitrogen. The orifice layer is disposed on over the substrate to form a manifold between the orifice layer and the substrate. The manifold is used for containing a fluid. The orifice layer has a nozzle communicated with to the manifold. When the resistor layer is charged, the resistor layer heats the adjacent fluid to generate a bubble therein so as to allow the fluid to be pushed out of the nozzle.

    摘要翻译： 提供一种流体喷射装置及其制造方法。 流体喷射装置包括基底，电阻层和孔层。 电阻层形成在基板上。 电阻层包括钽，硅和氮。 孔层设置在基板上方，以在孔板和基板之间形成歧管。 歧管用于容纳流体。 孔口层具有与歧管连通的喷嘴。 当电阻层被充电时，电阻层加热相邻的流体以在其中产生气泡，从而允许流体被推出喷嘴。

    Acoustic resonator device and method for manufacturing the same
    10.
    发明申请
    Acoustic resonator device and method for manufacturing the same 审中-公开
    声谐振器装置及其制造方法

    公开(公告)号：US20060125577A1

    公开(公告)日：2006-06-15

    申请号：US11008930

    申请日：2004-12-13

    申请人： Chin-Tang Hsieh ,  Ying-Chung Chen ,  Sean Wu ,  Chen-Kuei Chung ,  Kuo-Sheng Kao ,  Chin-Chi Chen

    发明人： Chin-Tang Hsieh ,  Ying-Chung Chen ,  Sean Wu ,  Chen-Kuei Chung ,  Kuo-Sheng Kao ,  Chin-Chi Chen

    IPC分类号： H03H9/56

    CPC分类号： H03H9/174 ,  H03H3/02

    摘要： An acoustic resonator device includes a semiconductor substrate, a FBAR (thin film bulk acoustic resonator) and a support plate. The FBAR is fabricated on the upper surface of the semiconductor substrate. The semiconductor substrate has a resonant cavity through the upper and the lower surfaces thereof. The support plate is attached to the lower surface of the semiconductor substrate to shelter the opening of the resonant cavity. Moreover, the support plate can provide a larger die-attaching area for the acoustic resonator device, for the protection of the resonant cavity from chipping during wafer sawing.

    摘要翻译： 声谐振器装置包括半导体衬底，FBAR（薄膜体声波谐振器）和支撑板。 FBAR制造在半导体衬底的上表面上。 半导体衬底通过其上表面和下表面具有谐振腔。 支撑板附接到半导体衬底的下表面以遮住谐振腔的开口。 此外，支撑板可以为声谐振器装置提供更大的管芯附着区域，用于在晶片锯切期间保护谐振腔免于碎裂。