公开(公告)号：US20100014259A1

公开(公告)日：2010-01-21

申请号：US12173230

申请日：2008-07-15

Applicant: Cheng Po Huang

Inventor： Cheng Po Huang

IPC: H05K1/14

CPC classification number: H05K1/0263 ,  H05K3/244 ,  H05K3/341 ,  H05K3/3457 ,  H05K2201/1028

Abstract: A modular circuit board structure for a large current area includes a circuit board having an electric conducting circuit and at least one large current area, and a conducting plate device having conducting plates installed onto the circuit board according to the shape of the large current area. When electronic components are inserted onto the circuit board by a surface mount technology, the conducting plates are attached onto the large current area to form a solder area portion on the conducting plates for allowing a large current to pass through, so as to provide a flexible combination function for the large current area of the circuit board and simplify the stamping molds of different shapes. The invention can avoid a waste of copper plates, assure the reliability, quality and safety of the circuit board, and enhance the cost effectiveness of the manufacture and the competitiveness of the product.

Abstract translation: 用于大电流区域的模块化电路板结构包括具有导电电路和至少一个大电流区域的电路板，以及具有根据大电流区域的形状安装在电路板上的导电板的导电板装置。 当通过表面贴装技术将电子元件插入到电路板上时，导电板被附着在大电流区域上，以在导电板上形成焊料区域部分，以允许大电流通过，从而提供柔性 电路板大电流区域的组合功能，简化了不同形状的冲压模具。 本发明可以避免铜板的浪费，确保电路板的可靠性，质量和安全性，提高制造的成本效益和产品的竞争力。