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公开(公告)号:US09337123B2
公开(公告)日:2016-05-10
申请号:US13546218
申请日:2012-07-11
申请人: Cheng-Chieh Hsieh , Way Lee Cheng , Shang-Yun Hou , Shin-Puu Jeng
发明人: Cheng-Chieh Hsieh , Way Lee Cheng , Shang-Yun Hou , Shin-Puu Jeng
IPC分类号: H01L23/367 , H01L23/427 , H01L21/56 , H01L25/065 , H01L23/00
CPC分类号: H01L23/427 , H01L21/563 , H01L23/3675 , H01L23/3677 , H01L23/562 , H01L25/0657 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06565 , H01L2225/06589
摘要: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.
摘要翻译: 一个或多个热管与衬底一起使用,以便提供通过衬底的热量,其可以在衬底和封装中的一个或多个半导体芯片之间的界面处积聚。 在一个实施例中,热管可以位于与半导体芯片相对的一侧的衬底上,并且通孔衬底可以用于通过衬底散热。 在替代实施例中,热管可以位于与半导体芯片相同的衬底侧上,并且可以热连接到一个或多个半导体芯片。
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公开(公告)号:US20140015106A1
公开(公告)日:2014-01-16
申请号:US13546218
申请日:2012-07-11
申请人: Cheng-Chieh Hsieh , Way Lee Cheng , Shang-Yun Hou , Shin-Puu Jeng
发明人: Cheng-Chieh Hsieh , Way Lee Cheng , Shang-Yun Hou , Shin-Puu Jeng
IPC分类号: H01L23/34
CPC分类号: H01L23/427 , H01L21/563 , H01L23/3675 , H01L23/3677 , H01L23/562 , H01L25/0657 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06565 , H01L2225/06589
摘要: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.
摘要翻译: 一个或多个热管与衬底一起使用,以便提供通过衬底的热量,其可以在衬底和封装中的一个或多个半导体芯片之间的界面处积聚。 在一个实施例中,热管可以位于与半导体芯片相对的一侧的衬底上,并且通孔衬底可以用于通过衬底散热。 在替代实施例中,热管可以位于与半导体芯片相同的衬底侧上,并且可以热连接到一个或多个半导体芯片。
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