公开(公告)号：US20100233360A1

公开(公告)日：2010-09-16

申请号：US12700488

申请日：2010-02-04

Applicant: Cheol Jin LEE ,  Sun Kug KIM

Inventor： Cheol Jin LEE ,  Sun Kug KIM

IPC: B05D5/12

CPC classification number: H01L51/0003 ,  B05D1/20 ,  B82Y10/00 ,  H01L51/0048 ,  H01L51/0075 ,  Y10S977/932

Abstract: A method of transferring an electronic material and a method of manufacturing an electronic device using the method of transferring the electronic material. The method of transferring the electronic material includes dipping a template, on which an electronic material layer is formed, into a liquid medium, separating the electronic material layer from the template, and floating the electronic material layer on a surface of the liquid medium; raising up the electronic material layer floated on the surface of the liquid medium by using a target substrate and transferring the electronic material layer on the target substrate; and fixing the electronic material layer to the target substrate.

Abstract translation: 使用转印电子材料的方法传送电子材料的方法和制造电子装置的方法。 转移电子材料的方法包括将形成有电子材料层的模板浸入液体介质中，将电子材料层与模板分离，并将电子材料层漂浮在液体介质的表面上; 通过使用目标基板升起浮在液体介质的表面上的电子材料层，并将电子材料层转印到目标基板上; 并将电子材料层固定到目标基板上。