公开(公告)号：US20100184255A1

公开(公告)日：2010-07-22

申请号：US12550959

申请日：2009-08-31

申请人： Chien LIU ,  Wen-Yuen Chuang ,  Chung-Yao Kao ,  Tsang-Hung Ou ,  Chih-Huang Chang ,  Wei-Chi Yih ,  Chen-Chuan Fan

发明人： Chien LIU ,  Wen-Yuen Chuang ,  Chung-Yao Kao ,  Tsang-Hung Ou ,  Chih-Huang Chang ,  Wei-Chi Yih ,  Chen-Chuan Fan

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  H01L23/3114 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A manufacturing method for package structure is provided. The manufacturing method includes the follow steps. Firstly, a substrate is provided. Next, a number of chips are provided. Then, the chips are electrically connected with the substrate. After that, the chips are encapsulated with a sealant, so that the chips and the substrate form a package. Then, the package is adhered by a vacuum force. Afterwards, the adhered package is singulated to form many package structures along the portion between adjacent two of airways.

摘要翻译： 提供一种封装结构的制造方法。 制造方法包括以下步骤。 首先，提供基板。 接下来，提供多个芯片。 然后，芯片与衬底电连接。 之后，用密封剂封装芯片，使得芯片和基板形成封装。 然后，通过真空力附着包装。 之后，将附着的包装物沿着相邻的两个气道之间的部分分开形成许多包装结构。