公开(公告)号：US06679064B2

公开(公告)日：2004-01-20

申请号：US10144521

申请日：2002-05-13

申请人： Chih-Wei Chang ,  Fa-Yuan Chang ,  Cheng-Ting Tseng ,  Chin-Chang Chen ,  Cheng-Cheng Chang ,  Shih-Fang Chen

发明人： Chih-Wei Chang ,  Fa-Yuan Chang ,  Cheng-Ting Tseng ,  Chin-Chang Chen ,  Cheng-Cheng Chang ,  Shih-Fang Chen

IPC分类号： F25B2102

CPC分类号： H01L35/32 ,  F25B21/04 ,  F25B2321/021

摘要： A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.

摘要翻译： 一种具有温度控制装置的晶片传送系统。 温度控制装置被构造和布置成使得材料，元素或原子粒子可以流过其中以加热或冷却由晶片传送系统承载的晶片。 流过温度控制装置的材料，元素或原子粒子使得热量被泵送到上表面或下表面。 优选地，温度控制装置是热电装置。 优选地，热电装置包括多个交替的N型和P型半导体芯片，其电串联并联并联并且并联连接到DC电源。 提供开关或继电器，用于从直流电源改变到热电装置的电流的方向。