公开(公告)号：US08674327B1

公开(公告)日：2014-03-18

申请号：US13468919

申请日：2012-05-10

申请人： Chin Yim Poon ,  Yew Ming Chiong ,  Paul C. Dorsey ,  Tatsuru Tanaka

发明人： Chin Yim Poon ,  Yew Ming Chiong ,  Paul C. Dorsey ,  Tatsuru Tanaka

IPC分类号： H01L21/265 ,  H01L21/00 ,  H05H1/02

CPC分类号： H01J37/3266 ,  H01J37/32082 ,  H01J37/32412 ,  H01L21/2236

摘要： Systems and methods for uniformly implanting materials on substrates using directed magnetic fields are provided. One such system includes a chamber configured to receive a preselected material and to enclose a first substrate, first and second rotating assemblies configured to facilitate an implantation of the preselected material onto first and second surfaces of the first substrate and including first and second rotating magnet sub-assemblies configured to direct magnetic fields onto the first and second surfaces, and an RF energizer configured to apply RF energy to the first substrate, where the first magnetic field and the second magnetic field combine to form a resultant magnetic field that is substantially parallel along the first surface, and where the implantation of the preselected material onto the first substrate occurs based on a combination of the RF energy and the resultant magnetic field.

摘要翻译： 提供了使用定向磁场将材料均匀地注入基板的系统和方法。 一个这样的系统包括被配置为接收预选材料并且包围第一衬底的腔室，第一和第二旋转组件被配置成便于将预选材料植入到第一衬底的第一和第二表面上，并且包括第一和第二旋转磁体子 配置成将磁场引导到第一和第二表面上的组件以及被配置为向第一衬底施加RF能量的RF激发器，其中第一磁场和第二磁场组合以形成基本上平行的合成磁场 第一表面，并且基于RF能量和所得到的磁场的组合，将预选材料注入到第一基板上。