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公开(公告)号:US06858874B2
公开(公告)日:2005-02-22
申请号:US10250184
申请日:2003-06-11
申请人: Chin-Long Wu , Tung-Yang Tang , Shih-Ming Hsu , Shang-Wei Chen , Tein-Wang Huang
发明人: Chin-Long Wu , Tung-Yang Tang , Shih-Ming Hsu , Shang-Wei Chen , Tein-Wang Huang
CPC分类号: H01L27/3288 , H01L27/3293 , H01L51/529
摘要: A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.
摘要翻译: OEL面板的封装结构包括印刷电路板,至少一个OEL面板和多个凸块。 其中,OEL面板具有以阵列结构排列的多个多焊料互连。 印刷电路板具有多个焊盘,也用凸块实现。 至少一个OEL面板设置在印刷电路板上,以通过多晶硅焊料互连和凸块与印刷电路板电连接。