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    Process of packaging organic electroluminescent panel
    2.
    发明授权
    Process of packaging organic electroluminescent panel 失效
    包装有机电致发光面板的工艺

    公开(公告)号：US06846687B2

    公开(公告)日：2005-01-25

    申请号：US10692473

    申请日：2003-10-22

    申请人： Chin-Long Wu ,  Tung-Yang Tang ,  Shih-Ming Hsu ,  Shang-Wei Chen

    发明人： Chin-Long Wu ,  Tung-Yang Tang ,  Shih-Ming Hsu ,  Shang-Wei Chen

    IPC分类号： H05K3/34 ,  H01L21/00

    CPC分类号： H01L27/3293 ,  H01L27/3288 ,  H01L51/524 ,  H01L51/5253 ,  H01L2224/16225 ,  H01L2924/12044 ,  H05K3/3436 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00

    摘要： A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.

    摘要翻译： 公开了一种包装OEL面板的过程。 提供一种印刷电路板，其中印刷电路板包括多个接合焊盘和在焊盘上的多个凸点。 接下来，提供至少一个具有多个聚合物焊接互连的OEL面板。 接下来，设置在印刷电路板上的OEL面板。 进行回流处理，使得OEL面板可以通过聚合物焊接互连与PCB电连接。 由于低温回流工艺，可以通过低温过程来实现包装OEL面板的过程。

    Light guide plate and backlight module using the same
    3.
    发明授权
    Light guide plate and backlight module using the same 有权
    导光板和背光模组使用相同

    公开(公告)号：US09329328B2

    公开(公告)日：2016-05-03

    申请号：US13873251

    申请日：2013-04-30

    申请人： Shang-Wei Chen ,  Min-Yi Hsu ,  Chao-Hung Weng ,  Wen-Hsin Lo ,  Han-Wen Tsai ,  Ming-Feng Kuo ,  Ming-Dah Liu

    发明人： Shang-Wei Chen ,  Min-Yi Hsu ,  Chao-Hung Weng ,  Wen-Hsin Lo ,  Han-Wen Tsai ,  Ming-Feng Kuo ,  Ming-Dah Liu

    IPC分类号： G02B6/00 ,  F21V8/00

    CPC分类号： G02B6/0053 ,  G02B6/0015 ,  G02B6/0016 ,  G02B6/0036 ,  G02B6/0051

    摘要： A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

    摘要翻译： 背光模块包括导光板（LGP），光源和至少一个棱镜片。 LGP包括底表面上的发光面，底面，光入射面和多个第一微结构。 第一微结构中的每一个是凹陷结构，并且包括第一表面和第二表面。 第一表面和底表面之间的夹角为15度至27度。 第二表面和底面之间的夹角为50度至90度。 光源提供光束，并且从LGP的发光面发射的光束的发光方向与发光面的法线方向之间的夹角大于30度。 棱镜片设置在发光面的上方。

    CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME 有权
    具有嵌入式半导体芯片的电路板结构及其制造方法

    公开(公告)号：US20080116565A1

    公开(公告)日：2008-05-22

    申请号：US11868010

    申请日：2007-10-05

    申请人： Shih-Ping HSU ,  Shang-Wei Chen

    发明人： Shih-Ping HSU ,  Shang-Wei Chen

    IPC分类号： H01L23/04 ,  H01L21/02

    CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/18162 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00

    摘要： The present invention provides a circuit board structure with an embedded semiconductor chip and a method for fabricating the same. The circuit board structure includes a carrier board having a first surface, a second surface, and a through hole penetrating the carrier board from the first surface to the second surface; a semiconductor chip having an active surface whereon a plurality of electrode pads are formed and a non-active surface, embedded in the through hole; a photosensitive first dielectric layer formed on the first surface of the carrier board and an opening formed thereon to expose the non-active surface of the semiconductor chip; a photosensitive second dielectric layer formed on the second surface of the carrier board and the active surface of the semiconductor chip.

    摘要翻译： 本发明提供一种具有嵌入式半导体芯片的电路板结构及其制造方法。 电路板结构包括具有第一表面，第二表面和从第一表面穿过载体板到第二表面的通孔的载体板; 具有形成有多个电极焊盘的活性表面的半导体芯片和埋入通孔中的非活性表面; 形成在所述载体板的第一表面上的光敏第一介电层和形成在其上的开口，以露出所述半导体芯片的非活性表面; 形成在所述载体板的第二表面上的感光性第二介电层和所述半导体芯片的有源表面。

    LIGHT GUIDE PLATE AND BACKLIGHT MODULE USING THE SAME
    6.
    发明申请
    LIGHT GUIDE PLATE AND BACKLIGHT MODULE USING THE SAME 有权
    光导板和背光模块使用相同

    公开(公告)号：US20130286679A1

    公开(公告)日：2013-10-31

    申请号：US13873251

    申请日：2013-04-30

    申请人： Shang-Wei Chen ,  Min-Yi Hsu ,  Chao-Hung Weng ,  Wen-Hsin Lo ,  Han-Wen Tsai ,  Ming-Feng Kuo ,  Ming-Dah Liu

    发明人： Shang-Wei Chen ,  Min-Yi Hsu ,  Chao-Hung Weng ,  Wen-Hsin Lo ,  Han-Wen Tsai ,  Ming-Feng Kuo ,  Ming-Dah Liu

    IPC分类号： F21V8/00

    CPC分类号： G02B6/0053 ,  G02B6/0015 ,  G02B6/0016 ,  G02B6/0036 ,  G02B6/0051

    摘要： A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

    摘要翻译： 背光模块包括导光板（LGP），光源和至少一个棱镜片。 LGP包括底表面上的发光面，底面，光入射面和多个第一微结构。 第一微结构中的每一个是凹陷结构，并且包括第一表面和第二表面。 第一表面和底表面之间的夹角为15度至27度。 第二表面和底面之间的夹角为50度至90度。 光源提供光束，并且从LGP的发光面发射的光束的发光方向与发光面的法线方向之间的夹角大于30度。 棱镜片设置在发光面的上方。

    PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF 审中-公开
    具有嵌入芯片的包装基板及其制造方法

    公开(公告)号：US20090032930A1

    公开(公告)日：2009-02-05

    申请号：US11832466

    申请日：2007-08-01

    申请人： Shih-Ping Hsu ,  Chung-Cheng Lien ,  Shang-Wei Chen ,  Kan-Jung Chia

    发明人： Shih-Ping Hsu ,  Chung-Cheng Lien ,  Shang-Wei Chen ,  Kan-Jung Chia

    IPC分类号： H01L21/52 ,  H01L23/18

    CPC分类号： H01L21/52 ,  H01L23/24 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/00

    摘要： A packaging substrate having a chip embedded therein, comprises a first aluminum substrate having a first cavity therein; a second aluminum substrate having a second cavity corresponding to the first cavity; a dielectric layer disposed between the first aluminum substrate and the second aluminum substrate; a chip embedded in the first cavity and the second cavity, having an active surface with a plurality of electrode pads thereon; and one built-up structure disposed on the surface of the first aluminum substrate and the active surface of the chip, wherein the built-up structure has a plurality of conductive vias electrically connecting to the electrode pads. The substrate warpage is obviously reduced by the assistance of using aluminum or aluminum alloy as the material of the substrate. Also, a method of manufacturing a packaging substrate having a chip embedded therein is disclosed.

    摘要翻译： 具有嵌入其中的芯片的封装基板包括其中具有第一腔的第一铝基板; 第二铝基板，具有对应于第一空腔的第二腔; 设置在所述第一铝基板和所述第二铝基板之间的电介质层; 嵌入在所述第一腔和所述第二腔中的芯片，具有其上具有多个电极焊盘的活性表面; 以及设置在第一铝基板的表面和芯片的有源表面上的一个堆积结构，其中，所述积层结构具有电连接到电极焊盘的多个导电通孔。 通过使用铝或铝合金作为基材的材料，显着减少了基板翘曲。 另外，公开了一种制造具有嵌入其中的芯片的封装衬底的方法。

    METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP
    10.
    发明申请
    METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP 审中-公开
    用嵌入式半导体芯片制作电路板结构的方法

    公开(公告)号：US20080145975A1

    公开(公告)日：2008-06-19

    申请号：US11956258

    申请日：2007-12-13

    申请人： Shih-Ping Hsu ,  Shang-Wei Chen

    发明人： Shih-Ping Hsu ,  Shang-Wei Chen

    IPC分类号： H01L21/58

    CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00

    摘要： The invention provides a method for fabricating printed circuit board having an embedded semiconductor chip, including: providing a carrier board including a first and a second surface and at least one through hole penetrating the first and second surfaces; disposing a semiconductor chip in the through hole and including an active surface and an inactive surface, the active surface including a plurality of electrode pads; forming at least one non photoimagable laminating layer on the first surface of the carrier board with a through hole to expose the inactive surface of the semiconductor chip; forming a dielectric layer on the second surface of the carrier board and the active surface of the semiconductor chip; and forming a circuit layer on the dielectric layer, the circuit layer electrically connecting to the electrode pads of the semiconductor chip through conductive structures in the dielectric layer, thereby preventing the carrier board from warpage due to temperature variations and an asymmetric structure during a single-side circuit formation process of the carrier board.

    摘要翻译： 本发明提供一种制造具有嵌入式半导体芯片的印刷电路板的方法，包括：提供包括第一和第二表面的载体板和穿过第一和第二表面的至少一个通孔; 在所述通孔中设置半导体芯片并且包括活性表面和非活性表面，所述活性表面包括多个电极焊盘; 在所述载体板的所述第一表面上形成至少一个不可光成像的层压层，其具有通孔以露出所述半导体芯片的非活性表面; 在载体板的第二表面和半导体芯片的有源表面上形成电介质层; 并且在电介质层上形成电路层，该电路层通过电介质层中的导电结构与半导体芯片的电极焊盘电连接，从而防止载体板由于温度变化而产生翘曲， 载板的侧电路形成过程。