公开(公告)号：US08772136B2

公开(公告)日：2014-07-08

申请号：US13483129

申请日：2012-05-30

申请人： Chine-Li Wang ,  Chun-Yen Chen ,  Wei-Hua Fang ,  Hung-Hsien Chang ,  Yung-Chin Yen

发明人： Chine-Li Wang ,  Chun-Yen Chen ,  Wei-Hua Fang ,  Hung-Hsien Chang ,  Yung-Chin Yen

IPC分类号： H01L21/78 ,  H01L21/46 ,  H01L21/301

CPC分类号： B81C1/00873 ,  H01L21/78

摘要： A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.

摘要翻译： 一种制造半导体器件的方法，其中所述方法包括以下步骤：首先，提供器件晶片，然后在器件晶片的划线区域内形成图案化结合层。 随后，通过图案化的接合层将处理晶片结合到器件晶片。 接下来，沿着划线区域进行切割处理，以便将器件晶片分成多个骰子并同时移除图案化的接合层，从而可以将分割的骰子与手柄晶片分离。