Method for forming ONO top oxide in NROM structure
    2.
    发明授权
    Method for forming ONO top oxide in NROM structure 有权
    在NROM结构中形成ONO顶部氧化物的方法

    公开(公告)号:US06962728B2

    公开(公告)日:2005-11-08

    申请号:US10440437

    申请日:2003-05-16

    CPC分类号: H01L21/28282 H01L21/3144

    摘要: A method for making a silicon oxide/silicon nitride/silicon oxide structure includes forming a tunnel oxide layer and a silicon nitride layer over a substrate; annealing the silicon nitride layer; forming a silicon oxide layer over the annealed silicon nitride layer by high temperature low pressure chemical vapor deposition; depositing a first gate layer over the silicon oxide layer; patterning to form a silicon oxide/silicon nitride/silicon oxide (ONO) structure; forming bit lines in the substrate adjacent the ONO structure; and annealing to form a thermal oxide over the bit lines.

    摘要翻译: 制造氧化硅/氮化硅/氧化硅结构的方法包括在衬底上形成隧道氧化物层和氮化硅层; 退火氮化硅层; 通过高温低压化学气相沉积在退火的氮化硅层上形成氧化硅层; 在所述氧化硅层上沉积第一栅极层; 图案化以形成氧化硅/氮化硅/氧化硅(ONO)结构; 在邻近ONO结构的衬底中形成位线; 并进行退火以在位线上形成热氧化物。