公开(公告)号：US20090275257A1

公开(公告)日：2009-11-05

申请号：US12189138

申请日：2008-08-09

申请人： Ching-Cherng Sun ,  Tsung-Xian Lee ,  Chun-te Wu

发明人： Ching-Cherng Sun ,  Tsung-Xian Lee ,  Chun-te Wu

IPC分类号： H01J9/02 ,  H05B7/00

CPC分类号： H01L33/505 ,  B29C45/14655 ,  B29C45/1671 ,  H01L2933/0041

摘要： An LED chip encapsulation process includes the steps of (a) forming a fluorescent member by injection molding to encapsulate an LED chip; (b) hardening the fluorescent member; (c) forming a transparent dome to embed and encapsulate the LED chip and the fluorescent member; and (d) securing the dome and the substrate together to finish a packaging of the LED chip. Shape of the fluorescent member disposed on the LED chip can be controlled precisely, thereby increasing quality and color uniformity of the produced LED chip. Alternatively, the LED chip is a remote LED chip and step (a) is replaced by forming a plastic member to encapsulate the LED chip and forming a fluorescent member on the top of the plastic member by injection molding.

摘要翻译： LED芯片封装工艺包括以下步骤：（a）通过注塑成型荧光部件以封装LED芯片; （b）使荧光部件硬化; （c）形成透明圆顶以嵌入和封装LED芯片和荧光部件; 和（d）将圆顶和基板固定在一起以完成LED芯片的封装。 可以精确地控制设置在LED芯片上的荧光体的形状，从而提高所制造的LED芯片的质量和颜色均匀性。 或者，LED芯片是远程LED芯片，并且通过形成塑料构件来代替步骤（a），以封装LED芯片并通过注射成型在塑料构件的顶部上形成荧光构件。