公开(公告)号：US20100059203A1

公开(公告)日：2010-03-11

申请号：US12399030

申请日：2009-03-06

Applicant: Ching-Hung Chu ,  Chang-Mu Li

Inventor： Ching-Hung Chu ,  Chang-Mu Li

IPC: F28F13/00

CPC classification number: H01L23/3672 ,  G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device for an electronic component includes a heat sink thermally contacting the electronic component and a label member fixed on the heat sink for providing information. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. Two engaging portions protrude from two spaced fins, towards each other. Two flanges angle outwardly from two opposite lateral sides of the label member and clasp the two engaging portions of the heat sink, respectively.

Abstract translation: 一种用于电子部件的散热装置包括热接触电子部件的散热器和固定在散热器上的用于提供信息的标签部件。 散热器包括基部和从基部的顶表面向上延伸的多个翅片。 两个接合部分从两个隔开的翅片彼此朝向彼此突出。 两个法兰从标签构件的两个相对的侧面向外侧倾斜并分别扣住散热器的两个接合部分。