公开(公告)号：US07907412B2

公开(公告)日：2011-03-15

申请号：US12456733

申请日：2009-06-22

申请人： Chinpyng J. Tzeng ,  Nan-Sheng Lin ,  Shailesh Patel ,  Jose Alvarellos

发明人： Chinpyng J. Tzeng ,  Nan-Sheng Lin ,  Shailesh Patel ,  Jose Alvarellos

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H05K7/20445 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic device with improved heat dissipation properties comprises metallic housing. A base circuit board may be positioned within the housing in a plane parallel to the backside. Multiple connectors for coupling cassettes to the base circuit board may be positioned about the periphery of the base circuit board such that multiple cassettes may be positioned adjacent to each side of the housing. Each cassette includes a printed circuit board with a plurality of heat generating components coupled to the printed circuit board and having a thickness extending towards the side of the housing. The cassette includes a metallic housing with a heat dissipation structure contacting: i) the side of the housing; and ii) each heat generating component. Each of at least two heat generating components have different thicknesses and the heat dissipation structure had different thicknesses between the side of the housing and each heat generating component.

摘要翻译： 具有改善的散热性能的电子设备包括金属外壳。 基座电路板可以在平行于背面的平面内定位在壳体内。 用于将盒连接到基座电路板的多个连接器可以围绕基本电路板的周边定位，使得多个盒可以邻近壳体的每一侧定位。 每个盒包括印刷电路板，其具有耦合到印刷电路板的多个发热部件，并且具有朝向壳体的侧面延伸的厚度。 盒式磁带包括具有接触的散热结构的金属壳体：i）壳体的侧面; 和ii）每个发热组件。 至少两个发热部件中的每一个具有不同的厚度，并且散热结构在壳体的侧面和每个发热部件之间具有不同的厚度。