INSPECTION APPARATUS AND METHOD FOR LED PACKAGE INTERFACE
    1.
    发明申请
    INSPECTION APPARATUS AND METHOD FOR LED PACKAGE INTERFACE 审中-公开
    LED封装接口的检查装置和方法

    公开(公告)号:US20110133769A1

    公开(公告)日:2011-06-09

    申请号:US12823859

    申请日:2010-06-25

    IPC分类号: G01R31/26 G01R31/02

    CPC分类号: G01R31/2635

    摘要: An LED package interface inspection apparatus for an LED device comprises a current source, a voltage measuring unit, and a testing control unit. The testing control unit provides at least one control signal to command the current source to output at least one current for the LED device. The testing control unit also provides at least two signals to command the voltage measuring unit to measure a first forward voltage of the LED device at a first time and a second forward voltage of the LED device at a second time. The testing control unit calculates a voltage difference between the first forward voltage and the second forward voltage, and determines that the LED device is defective if the voltage difference is larger than a predetermined threshold value.

    摘要翻译: 一种用于LED装置的LED封装接口检查装置,包括电流源,电压测量单元和测试控制单元。 测试控制单元提供至少一个控制信号以命令电流源输出LED器件的至少一个电流。 测试控制单元还提供至少两个信号以命令电压测量单元在第二时间测量LED器件的第一时间和第二正向电压。 测试控制单元计算第一正向电压和第二正向电压之间的电压差,并且如果电压差大于预定阈值,则确定LED器件有故障。