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公开(公告)号:US06634797B2
公开(公告)日:2003-10-21
申请号:US10033686
申请日:2001-12-27
Applicant: Sunney Yang , Tien Lu Kao , Frank Quach , Jim Xin Zhao , Chiu Yu Tang
Inventor: Sunney Yang , Tien Lu Kao , Frank Quach , Jim Xin Zhao , Chiu Yu Tang
IPC: G02B638
CPC classification number: G02B6/3672 , G02B6/3636 , G02B6/3644 , G02B6/3652 , G02B6/3821 , G02B6/3878 , G02B6/3885
Abstract: A multi-fiber array assembly comprises a main housing, a ferrule holder, a stopper, a front plate, a strain relief assembly, springs and ferrules with optical fibers retained therein. The ferrule holder is retained in the housing, and comprises a ferrule holding plate defining a first array of holes. The stopper is secured to the ferrule holder at a location rearward of the first array of holes, and defines a plurality of passages. The ferrules have a conical front ends, and are extended in the first array of holes. The springs are compressed between the ferrules and the stopper. The optical fibers extend through the passages of the stopper. The front plate is secured to a front end of the ferrule holder and defines a second array of the hole. Each hole of the second array has a rear conical section in which the conical front end of a corresponding ferrule is fitted.
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2.
公开(公告)号:US06734374B2
公开(公告)日:2004-05-11
申请号:US10161464
申请日:2002-05-30
Applicant: Chiu Yu Tang
Inventor: Chiu Yu Tang
IPC: H05K111
CPC classification number: H01R9/0515 , H01R4/027 , H01R43/01
Abstract: A method for soldering braiding layers of wires of a micro-coaxial cable to a substrate, wherein each wire includes a core conductor, an inner insulator, a braiding layer, and an outer insulator, comprises the steps of: exposing the braiding layers of the wires; providing a substrate having a thick layer of fusible element thereon; and arranging the braiding layers to the thick layer of the substrate while providing enough energy such that molten fusible element is substantially filled in interstitial space between the braiding layers of adjacent individual wires. An electrical cable assembly made by the above method is also disclosed.
Abstract translation: 一种用于将微同轴电缆的编织层焊接到基板的方法,其中每根导线包括芯导体,内绝缘体,编织层和外绝缘体,包括以下步骤:将所述编织层 电线 提供其上具有厚的可熔元件层的衬底; 并且在提供足够的能量的同时将编织层布置到基底的厚层上,使得熔融的可熔元件基本上填充在相邻的单根线的编织层之间的间隙空间中。 还公开了通过上述方法制造的电缆组件。
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