公开(公告)号：US20090284010A1

公开(公告)日：2009-11-19

申请号：US12537142

申请日：2009-08-06

申请人： Chris Huskamp ,  Tracy L. Bagwill

发明人： Chris Huskamp ,  Tracy L. Bagwill

IPC分类号： F16L21/00

CPC分类号： B28B1/00 ,  B22F3/1055 ,  B22F5/106 ,  B22F7/062 ,  B28B1/001 ,  B29C64/00 ,  B33Y70/00 ,  B33Y80/00 ,  Y02P10/295

摘要： A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.

摘要翻译： 用于形成管道互连的方法通常包括提供第一管道结构和第二管道结构的数字模型，所述第一管道结构包括第一管道段，其具有用于传送物质的通道和互连部件， 管段。 第二管道结构包括第二管道结构和第二互连部件。 该过程包括通过直接制造程序（例如，立体光刻）形成根据数字模型的第一管道和第二结构的物理模型，其中互连部件具有锁定和解锁状态，并且其中解锁状态对应于 到第一管道结构和第二管道结构之间的预定压缩力。

公开(公告)号：US08104799B2

公开(公告)日：2012-01-31

申请号：US12537142

申请日：2009-08-06

申请人： Chris Huskamp ,  Tracy L. Bagwill

发明人： Chris Huskamp ,  Tracy L. Bagwill

IPC分类号： F16L19/00

CPC分类号： B28B1/00 ,  B22F3/1055 ,  B22F5/106 ,  B22F7/062 ,  B28B1/001 ,  B29C64/00 ,  B33Y70/00 ,  B33Y80/00 ,  Y02P10/295

摘要： A duct connection system has a direct-manufactured first duct structure including a first duct section. The first duct section has a passage for conveying a substance and a first interconnect component moveably and captivity coupled to the duct section. The duct connection system also has a direct-manufactured second duct structure including a second duct section. The second duct section has a passage for conveying the substance and a first interconnect component configured to enter a locked state with the first interconnect component such that a sealing force between the first and second duct structures is substantially equal to a predetermined value.

摘要翻译： 管道连接系统具有包括第一管道部分的直接制造的第一管道结构。 第一管道部分具有​​用于传送物质和第一互连部件的通道，其可移动地并且被限制地联接到管道部分。 管道连接系统还具有包括第二管道部分的直接制造的第二管道结构。 第二管道部分具有​​用于输送物质的通道和被配置为与第一互连部件进入锁定状态的第一互连部件，使得第一和第二管道结构之间的密封力基本上等于预定值。

公开(公告)号：US20070278794A1

公开(公告)日：2007-12-06

申请号：US11422052

申请日：2006-06-02

申请人： Chris Huskamp ,  Tracy L. Bagwill

发明人： Chris Huskamp ,  Tracy L. Bagwill

IPC分类号： F16L21/00

CPC分类号： B28B1/00 ,  B22F3/1055 ,  B22F5/106 ,  B22F7/062 ,  B28B1/001 ,  B29C64/00 ,  B33Y70/00 ,  B33Y80/00 ,  Y02P10/295

摘要： A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.

摘要翻译： 用于形成管道互连的方法通常包括提供第一管道结构和第二管道结构的数字模型，所述第一管道结构包括第一管道段，其具有用于传送物质的通道和互连部件， 管段。 第二管道结构包括第二管道结构和第二互连部件。 该过程包括通过直接制造程序（例如，立体光刻）形成根据数字模型的第一管道和第二结构的物理模型，其中互连部件具有锁定和解锁状态，并且其中解锁状态对应于 到第一管道结构和第二管道结构之间的预定压缩力。

公开(公告)号：US07623940B2

公开(公告)日：2009-11-24

申请号：US11422052

申请日：2006-06-02

申请人： Chris Huskamp ,  Tracy L. Bagwill

发明人： Chris Huskamp ,  Tracy L. Bagwill

IPC分类号： G06F19/00 ,  G06F17/50 ,  F16L9/18 ,  F16L21/02 ,  F16L23/00

CPC分类号： B28B1/00 ,  B22F3/1055 ,  B22F5/106 ,  B22F7/062 ,  B28B1/001 ,  B29C64/00 ,  B33Y70/00 ,  B33Y80/00 ,  Y02P10/295

摘要： A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.

摘要翻译： 用于形成管道互连的方法通常包括提供第一管道结构和第二管道结构的数字模型，所述第一管道结构包括第一管道段，其具有用于传送物质的通道和互连部件， 管段。 第二管道结构包括第二管道结构和第二互连部件。 该过程包括通过直接制造程序（例如，立体光刻）形成根据数字模型的第一管道和第二结构的物理模型，其中互连部件具有锁定和解锁状态，并且其中解锁状态对应于 到第一管道结构和第二管道结构之间的预定压缩力。