摘要:
Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.
摘要:
The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.
摘要:
Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.
摘要:
The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.
摘要:
An optical transceiver module for use in optical communications networks is disclosed. The transceiver features a simplified optical subassembly structure that facilitates the alignment and calibration of active optical components located thereon. The transceiver includes a shell that contains a transceiver printed circuit board and a transmitter/receiver optical subassembly (“TROSA”) connected to the printed circuit board via a TROSA connector. The TROSA includes a singular substrate on which a laser for producing optical signals and a photodetector for receiving optical signals are disposed. The laser and photodetector are precisely positioned on the TROSA substrate to have a specified spacing therebetween. So positioned, the laser and photodetector can be aligned with conduits of a sleeve assembly in a single alignment operation, thereby simplifying calibration of the transceiver module. The present transceiver eliminates the use of multiple substrates separately supporting the laser and the photodetector, thus also eliminating related alignment challenges.
摘要:
An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.
摘要:
An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.
摘要:
An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.
摘要:
Embodiments of the present invention are directed to dual stage modular optical devices with insert digital diagnostics components. A first portion of a leadframe couples a first fabricated package including a light source and/or light detector to a second fabricated package with first opening for receiving inserts. A second portion of the leadframe couples the second fabricated package to a third fabricated package with a second opening for receiving inserts. A first component insert is coupled to the second fabricated package such that components of the first component insert can electrically interoperate with the light source and/or light detector. A second component insert is coupled to the third fabricated package such that components of the second component insert can electrically interoperate with components of the first component insert to implement digital diagnostics functions.
摘要:
An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.