公开(公告)号：US20090185343A1

公开(公告)日：2009-07-23

申请号：US12198660

申请日：2008-08-26

Applicant: Chun-Kai WU

Inventor： Chun-Kai WU

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/00

CPC classification number: G06F1/20 ,  F28D15/00 ,  F28F2210/02 ,  F28F2215/06 ,  F28F2215/10 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A water-cooling radiator for a computer chip is provided to lower the temperature of the computer chip. The radiator includes a body on which other elements can be fixed and providing an interface for heat exchange, an internal circulation flow path built inside the body to provide a passage required for the coolant to flow through, and a pump fixed to the side of the body near the computer chip to provide power required for the coolant circulation.

Abstract translation: 提供了一种用于计算机芯片的水冷散热器以降低计算机芯片的温度。 散热器包括其上可以固定有其它元件并提供用于热交换的界面的主体，内部循环流动路径，其构建在主体内部以提供冷却剂流过所需的通道，以及固定在该侧面的泵 身体靠近计算机芯片，以提供冷却液循环所需的电力。