公开(公告)号：US20240326252A1

公开(公告)日：2024-10-03

申请号：US18194674

申请日：2023-04-03

申请人： Ciena Corporation

发明人： Raphael Beaupré-Laflamme ,  Simon Savard ,  Jean-Sébastien Côté

IPC分类号： B25J9/16 ,  B25J13/08 ,  B25J17/02

CPC分类号： B25J9/1687 ,  B25J13/088 ,  B25J17/0225

摘要： In one aspect, in general, a method for placing a chip for device manufacturing comprises: picking up the chip with a component placement tool comprises a tool surface; spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising beginning the spatially translating at a first spatial coordinate with respect to the direction, and ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction.