-
公开(公告)号：US11639557B2
公开(公告)日：2023-05-02
申请号：US17434943
申请日：2019-02-28
发明人： Zainhia Kaidi , Thomas Devahif , Adrien Kersten , Michel Streel
摘要： A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.
-
公开(公告)号：US20210298213A1
公开(公告)日：2021-09-23
申请号：US17184907
申请日：2021-02-25
发明人： ROMAN MICHEZ , Thomas DEVAHIF , Zainhia Kaidi , Michel Streel
摘要： A surface-treated copper foil, which is excellent in adhesiveness with an insulating substrate for a high-frequency circuit, and particularly is capable of producing a copper clad laminate where occurrence of blisters are suppressed even when a thermal load due to high temperature press-working is applied. More particularly, it is a surface-treated copper foil for a high-frequency circuit having a heat resisting treated layer formed on a copper foil of 35 μm or less in thickness, in which the heat resisting treated layer is characterized by a film including a quaternary metal oxide of chromium, molybdenum, zinc, and nickel and a compound thereof, characterizes the present invention.
-
搜索结果
2 条记录 (耗时 0.01 秒)
