公开(公告)号：US20240074093A1

公开(公告)日：2024-02-29

申请号：US17900147

申请日：2022-08-31

申请人： Cisco Technology, Inc.

发明人： Chejung Liu ,  Ravinandana Mysore Ramachandra Rao ,  Vic Hong Chia

IPC分类号： H05K7/20 ,  G05D7/01

CPC分类号： H05K7/20145 ,  G05D7/0173

摘要： A dynamic air baffle comprises: spaced-apart first and second plates configured to be positioned adjacent to at least one heat source to be cooled by an airflow; a heat insulator sandwiched between the first and second plates; and an air flap coupled to the first and second plates and extending into the airflow; wherein the first and second plates are configured such that a differential temperature between the first and second plates causes a differential expansion in lengths of the first and second plates, which rotates the air flap from a rest position, corresponding to when the differential temperature is zero, to a rotated position that is closer to a cooler plate and farther from a hotter plate of the first and second plates, such that the air flap directs more of the airflow to the hotter plate and less of the airflow to the cooler plate.

公开(公告)号：US20230422449A1

公开(公告)日：2023-12-28

申请号：US17846494

申请日：2022-06-22

申请人： Cisco Technology, Inc.

发明人： Chejung Liu ,  Ravinandana Mysore Ramachandra Rao ,  Vic Hong Chia

IPC分类号： H05K7/20

CPC分类号： H05K7/2049 ,  H05K7/20418

摘要： According to one embodiment, an apparatus is provided that includes a first block and a second block, one or more springs provided between the first block and the second block, and a thermally conductive wrap extending from the first block to the second block, wherein the thermally conductive wrap is configured to conduct heat away from the first block. An assembly including a chassis, a receptacle, and the apparatus is also provided, as well as a method for operating the apparatus.

公开(公告)号：US12022639B2

公开(公告)日：2024-06-25

申请号：US17670608

申请日：2022-02-14

申请人： Cisco Technology, Inc.

发明人： Chejung Liu ,  Vic Hong Chia

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K7/20409 ,  H05K1/0203

摘要： An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.

公开(公告)号：US20230262938A1

公开(公告)日：2023-08-17

申请号：US17670608

申请日：2022-02-14

申请人： Cisco Technology, Inc.

发明人： Chejung Liu ,  Vic Hong Chia

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K7/20409 ,  H05K1/0203

摘要： An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.