公开(公告)号：US09151950B2

公开(公告)日：2015-10-06

申请号：US13678915

申请日：2012-11-16

Applicant: Cisco Technology, Inc.

Inventor： Kishor V. Desai ,  Ravinder Kachru ,  Soham R. Pathak ,  Utpal Kumar Chakrabarti

IPC: G02B7/18 ,  G02B27/00 ,  G02B6/42

CPC classification number: G02B27/0006 ,  G02B6/4257 ,  Y10T156/10

Abstract: Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.

Abstract translation: 提供了用于封装光电器件的技术和配置。 特别地，提供了光电子器件的盖部件，并且盖部件构造成覆盖光电子器件的有源部件。 还提供了光学透明的壁。 光学透明壁涂有抗反射材料并且被配置为与盖部件的一部分相接合。 光学透明壁与盖部件的部分连接，使得光学透明壁和盖为光电器件的有源部件提供密封。 此外，盖部件具有联接到顶表面的顶表面和多个侧表面。 涂有抗反射材料的光学透明壁粘合地连接到顶表面和一个或多个侧表面。

公开(公告)号：US20140043685A1

公开(公告)日：2014-02-13

申请号：US13678915

申请日：2012-11-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Kishor V. Desai ,  Ravinder Kachru ,  Soham R. Pathak ,  Utpal Kumar Chakrabarti

IPC: G02B27/00

CPC classification number: G02B27/0006 ,  G02B6/4257 ,  Y10T156/10

Abstract: Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.

Abstract translation: 提供了用于封装光电器件的技术和配置。 特别地，提供了光电子器件的盖部件，并且盖部件构造成覆盖光电子器件的有源部件。 还提供了光学透明的壁。 光学透明壁涂有抗反射材料并且被配置为与盖部件的一部分相接合。 光学透明壁与盖部件的部分连接，使得光学透明壁和盖为光电器件的有源部件提供密封。 此外，盖部件具有联接到顶表面的顶表面和多个侧表面。 涂有抗反射材料的光学透明壁粘合地连接到顶表面和一个或多个侧表面。