公开(公告)号：US20240272385A1

公开(公告)日：2024-08-15

申请号：US18167003

申请日：2023-02-09

Applicant: Cisco Technology, Inc.

Inventor： Li CHEN ,  Long CHEN ,  Norbert SCHLEPPLE ,  Aparna R. PRASAD ,  Vipulkumar K. PATEL

IPC: G02B6/42

CPC classification number: G02B6/4251 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4238

Abstract: Photonic packages with underfill dam structures are described. The underfill dam structures address various underfill material location issues by controlling where an underfill material flows and which areas of the photonic package underfill material is excluded from entering.