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公开(公告)号：US20220099901A1
公开(公告)日：2022-03-31
申请号：US17643312
申请日：2021-12-08
摘要： Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.
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公开(公告)号：US20240264387A1
公开(公告)日：2024-08-08
申请号：US18163806
申请日：2023-02-02
发明人： Weizhuo LI , Norbert SCHLEPPLE , Jock T. BOVINGTON
IPC分类号： G02B6/42
CPC分类号： G02B6/4207 , G02B6/4216 , G02B6/4227
摘要： The optical devices described herein include a lens arrangement for coupling light between light sources and optical fibers with a reduced size compared to the use of optical waveguides, while also allowing for the use of power sensitive optical components, such as components with lower power density configurations. The lens arrangements include a collimating lens, a focusing lens, and at least one optical component positioned between the collimating lens and the focusing lens.
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公开(公告)号：US20240184066A1
公开(公告)日：2024-06-06
申请号：US18061881
申请日：2022-12-05
CPC分类号： G02B6/4239 , G02B6/4238 , G02B6/4245 , G02B6/4255 , G02B6/4257 , G02B6/426 , G02B6/428 , H04B10/40
摘要： In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.
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公开(公告)号：US20240304512A1
公开(公告)日：2024-09-12
申请号：US18182072
申请日：2023-03-10
IPC分类号： H01L23/367 , G02B6/38 , H01L23/50
CPC分类号： H01L23/367 , G02B6/3897 , H01L23/50
摘要： An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.
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公开(公告)号：US20240248258A1
公开(公告)日：2024-07-25
申请号：US18157626
申请日：2023-01-20
IPC分类号： G02B6/30
CPC分类号： G02B6/305
摘要： An optical coupler and a method performed by the optical coupler are described. The optical coupler includes an interlayer dielectric, a waveguide disposed within the interlayer dielectric, and an epoxy disposed on the interlayer dielectric and in the first cavity such that the epoxy defines an upper surface and a bottom surface. The interlayer dielectric includes a first surface and a second surface coupled to the first surface. The first surface and the second surface define a first cavity in the interlayer dielectric. The waveguide emits an optical signal through the first surface. The bottom surface is positioned between the interlayer dielectric and the upper surface. The epoxy directs the optical signal from the first surface to the second surface. The second surface and the epoxy direct a first portion of the optical signal through the upper surface.
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公开(公告)号：US20240272370A1
公开(公告)日：2024-08-15
申请号：US18168230
申请日：2023-02-13
发明人： Norbert SCHLEPPLE , Neda NOBLE
IPC分类号： G02B6/36
CPC分类号： G02B6/3636 , G02B6/3652
摘要： The fiber array units (FAUs) described herein include an FAU substrate with a coupling surface, an array of V-grooves formed in a FAU substrate, and a plurality of optical channels individually disposed in a respective V-groove of the array of V-grooves. The array of V-grooves and the optical channels are configured to position the optical channels along a curve defined in the coupling surface such that the optical channels are aligned with waveguides in a warped photonic device.
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公开(公告)号：US20240264370A1
公开(公告)日：2024-08-08
申请号：US18165844
申请日：2023-02-07
CPC分类号： G02B6/12004 , G02B6/13 , G02B2006/12061
摘要： An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.
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公开(公告)号：US20230296840A1
公开(公告)日：2023-09-21
申请号：US18324630
申请日：2023-05-26
CPC分类号： G02B6/2555 , G02B6/12 , G02B6/2551 , G02B6/2553 , G02B2006/12138 , G02B2006/12192
摘要： Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding.
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公开(公告)号：US20230163561A1
公开(公告)日：2023-05-25
申请号：US18158879
申请日：2023-01-24
CPC分类号： H01S5/02453 , H01S3/06704 , H01S5/02469 , B23K2101/14
摘要： Aspects described herein include a method of fabricating an optical component, the optical component, and a method of operating the optical component. A method includes electrically coupling a first laser channel and a second laser channel of a laser die to different electrical leads and testing (i) a first optical coupling of the first laser channel and a second optical coupling of the second laser channel or (ii) a first spectral performance of the first laser channel and a second spectral performance of the second laser channel. The method also includes optically aligning an optical fiber with the first laser channel and designating the second laser channel as a heater element for the first laser channel based at least in part on (i) the first optical coupling being greater than the second optical coupling or (ii) the first spectral performance relative to the second spectral performance
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公开(公告)号：US20220252789A1
公开(公告)日：2022-08-11
申请号：US17660993
申请日：2022-04-27
摘要： Aspects described herein include an optical apparatus comprising a plurality of light-carrying media, a wavelength division multiplexing (WDM) device optically coupled with the plurality of light-carrying media, and a lens arranged between the WDM device and a multicore optical fiber. An arrangement of the plurality of light carrying media and the WDM device are selected to align each of the plurality of light-carrying media with a respective optical core of the multicore optical fiber.
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