公开(公告)号：US20240304512A1

公开(公告)日：2024-09-12

申请号：US18182072

申请日：2023-03-10

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Aparna R. PRASAD ,  Paul TON

IPC: H01L23/367 ,  G02B6/38 ,  H01L23/50

CPC classification number: H01L23/367 ,  G02B6/3897 ,  H01L23/50

Abstract: An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.

公开(公告)号：US20240248258A1

公开(公告)日：2024-07-25

申请号：US18157626

申请日：2023-01-20

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Donald J. ADAMS ,  Vipulkumar K. PATEL

IPC: G02B6/30

CPC classification number: G02B6/305

Abstract: An optical coupler and a method performed by the optical coupler are described. The optical coupler includes an interlayer dielectric, a waveguide disposed within the interlayer dielectric, and an epoxy disposed on the interlayer dielectric and in the first cavity such that the epoxy defines an upper surface and a bottom surface. The interlayer dielectric includes a first surface and a second surface coupled to the first surface. The first surface and the second surface define a first cavity in the interlayer dielectric. The waveguide emits an optical signal through the first surface. The bottom surface is positioned between the interlayer dielectric and the upper surface. The epoxy directs the optical signal from the first surface to the second surface. The second surface and the epoxy direct a first portion of the optical signal through the upper surface.

公开(公告)号：US20250028125A1

公开(公告)日：2025-01-23

申请号：US18356811

申请日：2023-07-21

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE

IPC: G02B6/38

Abstract: An optical connector is provided. The optical connector includes an optical fiber and a ferrule mated with the optical fiber. The ferrule has a lens spaced from an end of the optical fiber. The lens is configured to focus an optical signal received from the optical fiber to converge to a beam waist before diverging thereafter.

公开(公告)号：US20240264387A1

公开(公告)日：2024-08-08

申请号：US18163806

申请日：2023-02-02

Applicant: Cisco Technology, Inc.

Inventor： Weizhuo LI ,  Norbert SCHLEPPLE ,  Jock T. BOVINGTON

IPC: G02B6/42

CPC classification number: G02B6/4207 ,  G02B6/4216 ,  G02B6/4227

Abstract: The optical devices described herein include a lens arrangement for coupling light between light sources and optical fibers with a reduced size compared to the use of optical waveguides, while also allowing for the use of power sensitive optical components, such as components with lower power density configurations. The lens arrangements include a collimating lens, a focusing lens, and at least one optical component positioned between the collimating lens and the focusing lens.

公开(公告)号：US20240184066A1

公开(公告)日：2024-06-06

申请号：US18061881

申请日：2022-12-05

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Aparna R. PRASAD ,  Vipulkumar K. PATEL

IPC: G02B6/42 ,  H04B10/40

CPC classification number: G02B6/4239 ,  G02B6/4238 ,  G02B6/4245 ,  G02B6/4255 ,  G02B6/4257 ,  G02B6/426 ,  G02B6/428 ,  H04B10/40

Abstract: In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.

公开(公告)号：US20250123451A1

公开(公告)日：2025-04-17

申请号：US18487623

申请日：2023-10-16

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Joyce J.M. PETERNEL

IPC: G02B6/42

Abstract: An optical engine and methods of assembly are disclosed. In one aspect, an optical engine has a lid defining an optical feedthrough configured to fully encircle an optical channel received therein. The optical feedthrough provides an access opening for the optical channel to be fed through so that the optical channel is coupled with a photonic integrated circuit of the optical engine.

公开(公告)号：US20250030497A1

公开(公告)日：2025-01-23

申请号：US18353781

申请日：2023-07-17

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Romesh Kumar NANDWANA ,  Norbert SCHLEPPLE ,  Eng Wen ONG ,  Prakash B. GOTHOSKAR

IPC: H04J14/06 ,  H04B10/67

Abstract: The present disclosure describes an optical system and method of operating the optical system. The optical system includes a substrate and first and second photonic integrated circuits. The first photonic integrated circuit is positioned on the substrate. The second photonic integrated circuit is positioned on the first photonic integrated circuit. The second photonic integrated circuit receives a first optical signal that includes a first mode and a second mode. The second photonic integrated circuit includes a polarization splitter rotator, a first demultiplexer, and a second demultiplexer. The polarization splitter rotator separates the first optical signal into a second optical with the first mode and a third optical signal with the first mode. The first and second demultiplexers separate the second and third optical signals into first and second pluralities of optical signals. The first and second pluralities of optical signals couple into the first photonic integrated circuit.

公开(公告)号：US20220099901A1

公开(公告)日：2022-03-31

申请号：US17643312

申请日：2021-12-08

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Jock T. BOVINGTON

IPC: G02B6/42 ,  G02B6/02

Abstract: Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

公开(公告)号：US20240272385A1

公开(公告)日：2024-08-15

申请号：US18167003

申请日：2023-02-09

Applicant: Cisco Technology, Inc.

Inventor： Li CHEN ,  Long CHEN ,  Norbert SCHLEPPLE ,  Aparna R. PRASAD ,  Vipulkumar K. PATEL

IPC: G02B6/42

CPC classification number: G02B6/4251 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4238

Abstract: Photonic packages with underfill dam structures are described. The underfill dam structures address various underfill material location issues by controlling where an underfill material flows and which areas of the photonic package underfill material is excluded from entering.

公开(公告)号：US20230251427A1

公开(公告)日：2023-08-10

申请号：US17650601

申请日：2022-02-10

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Weizhuo LI

IPC: G02B6/30

CPC classification number: G02B6/30

Abstract: An apparatus includes a ribbon, an optical waveguide, and an IC. The ribbon includes a first end. The optical waveguide is disposed within the ribbon and terminates at the first end. The IC includes a curved surface. The first end of the ribbon bends to mate with the curved surface such that the optical waveguide is optically coupled to a corresponding waveguide in the IC.