公开(公告)号：US11129303B1

公开(公告)日：2021-09-21

申请号：US16802641

申请日：2020-02-27

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Bhatia ,  Mark Hong Chen

IPC: H05K7/20 ,  H05K1/02

Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

公开(公告)号：US20210274685A1

公开(公告)日：2021-09-02

申请号：US16802641

申请日：2020-02-27

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Bhatia ,  Mark Hong Chen

IPC: H05K7/20 ,  H05K1/02

Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

公开(公告)号：US10565974B1

公开(公告)日：2020-02-18

申请号：US15894345

申请日：2018-02-12

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Bhatia ,  Daniel Bernard Hruska ,  Mark Hong Chen ,  Bradley Ray Rentfrow

IPC: G10K11/162 ,  H05K7/20 ,  H05K7/14

Abstract: An apparatus includes a housing, one or more storage drives, one or more fans, and one or more acoustic barriers. The housing includes a bottom side bounded by a front side, a back side, a first side, and a second side opposite the first side. The housing may further include a top cover removably attached to the housing. The storage drives may be disposed within the housing at a first location. The fans may be disposed within the housing at a second location spaced from the first location. The fans may generate a flow of air through the housing, while simultaneously generating sound waves that travel throughout the housing. The acoustic barriers may be disposed between the storage drives and the fans, and configured to attenuate the sounds waves prior to the sound waves reaching the storage drives in order to reduce the throughput performance degradation of the drives.