CLOSED LOOP HYBRID COOLING
    1.
    发明申请

    公开(公告)号:US20200341524A1

    公开(公告)日:2020-10-29

    申请号:US16871620

    申请日:2020-05-11

    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

    Attenuation of acoustic pressures in rackmount servers to reduce drive performance degradation

    公开(公告)号:US10565974B1

    公开(公告)日:2020-02-18

    申请号:US15894345

    申请日:2018-02-12

    Abstract: An apparatus includes a housing, one or more storage drives, one or more fans, and one or more acoustic barriers. The housing includes a bottom side bounded by a front side, a back side, a first side, and a second side opposite the first side. The housing may further include a top cover removably attached to the housing. The storage drives may be disposed within the housing at a first location. The fans may be disposed within the housing at a second location spaced from the first location. The fans may generate a flow of air through the housing, while simultaneously generating sound waves that travel throughout the housing. The acoustic barriers may be disposed between the storage drives and the fans, and configured to attenuate the sounds waves prior to the sound waves reaching the storage drives in order to reduce the throughput performance degradation of the drives.

    PREDICTIVE MONITORING OF COMPUTER COOLING SYSTEMS

    公开(公告)号:US20180373300A1

    公开(公告)日:2018-12-27

    申请号:US15628694

    申请日:2017-06-21

    Abstract: Predictive monitoring of computer cooling systems includes generating, at a computer system, a model representative of at least a relationship between a rotational speed of one or more fans configured to cool computing components and a duty cycle of the pulse-width modulation of electrical current supplied to the one or more fans. The computer system determines a first effective range for the rotational speed of the one or more fans as a function of the duty cycle based on the model and monitors data representative of the rotational speed of the one or more fans and data representative of the duty cycle. The computer system generates a predictive failure alert when the data representative of the rotational speed indicates that the rotational speed is outside of the first effective range for a particular value of the duty cycle.

    Cooling of server high-power devices using double-base primary and secondary heat sinks

    公开(公告)号:US11129303B1

    公开(公告)日:2021-09-21

    申请号:US16802641

    申请日:2020-02-27

    Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

    Closed loop hybrid cooling
    6.
    发明授权

    公开(公告)号:US11119543B2

    公开(公告)日:2021-09-14

    申请号:US16871620

    申请日:2020-05-11

    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

    COOLING OF SERVER HIGH-POWER DEVICES USING DOUBLE-BASE PRIMARY AND SECONDARY HEAT SINKS

    公开(公告)号:US20210274685A1

    公开(公告)日:2021-09-02

    申请号:US16802641

    申请日:2020-02-27

    Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

    Closed loop hybrid cooling
    8.
    发明授权

    公开(公告)号:US10684661B1

    公开(公告)日:2020-06-16

    申请号:US16358525

    申请日:2019-03-19

    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

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