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公开(公告)号：US20200341524A1
公开(公告)日：2020-10-29
申请号：US16871620
申请日：2020-05-11
Applicant: Cisco Technology, Inc.
Inventor： Anant Thakar , Rakesh Bhatia
Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.
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公开(公告)号：US10721838B1
公开(公告)日：2020-07-21
申请号：US16198542
申请日：2018-11-21
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rakesh Bhatia , Eric Michael Lotter
IPC: H05K7/20 , H05K1/18 , H05K1/02 , H01L23/467 , H01L23/367
Abstract: In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.
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3.发明授权公开(公告)号：US10565974B1
公开(公告)日：2020-02-18
申请号：US15894345
申请日：2018-02-12
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Bhatia , Daniel Bernard Hruska , Mark Hong Chen , Bradley Ray Rentfrow
IPC: G10K11/162 , H05K7/20 , H05K7/14
Abstract: An apparatus includes a housing, one or more storage drives, one or more fans, and one or more acoustic barriers. The housing includes a bottom side bounded by a front side, a back side, a first side, and a second side opposite the first side. The housing may further include a top cover removably attached to the housing. The storage drives may be disposed within the housing at a first location. The fans may be disposed within the housing at a second location spaced from the first location. The fans may generate a flow of air through the housing, while simultaneously generating sound waves that travel throughout the housing. The acoustic barriers may be disposed between the storage drives and the fans, and configured to attenuate the sounds waves prior to the sound waves reaching the storage drives in order to reduce the throughput performance degradation of the drives.
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Patent Agency Ranking
公开(公告)号：US20180373300A1
公开(公告)日：2018-12-27
申请号：US15628694
申请日：2017-06-21
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Bhatia , Krishna Tejaswi Mocherla , Samruddhi Deshpande
Abstract: Predictive monitoring of computer cooling systems includes generating, at a computer system, a model representative of at least a relationship between a rotational speed of one or more fans configured to cool computing components and a duty cycle of the pulse-width modulation of electrical current supplied to the one or more fans. The computer system determines a first effective range for the rotational speed of the one or more fans as a function of the duty cycle based on the model and monitors data representative of the rotational speed of the one or more fans and data representative of the duty cycle. The computer system generates a predictive failure alert when the data representative of the rotational speed indicates that the rotational speed is outside of the first effective range for a particular value of the duty cycle.
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公开(公告)号：US11129303B1
公开(公告)日：2021-09-21
申请号：US16802641
申请日：2020-02-27
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Bhatia , Mark Hong Chen
Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.
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公开(公告)号：US11119543B2
公开(公告)日：2021-09-14
申请号：US16871620
申请日：2020-05-11
Applicant: Cisco Technology, Inc.
Inventor： Anant Thakar , Rakesh Bhatia
Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.
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公开(公告)号：US20210274685A1
公开(公告)日：2021-09-02
申请号：US16802641
申请日：2020-02-27
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Bhatia , Mark Hong Chen
Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.
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公开(公告)号：US10684661B1
公开(公告)日：2020-06-16
申请号：US16358525
申请日：2019-03-19
Applicant: Cisco Technology, Inc.
Inventor： Anant Thakar , Rakesh Bhatia
Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.
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