公开(公告)号：US20220011056A1

公开(公告)日：2022-01-13

申请号：US16922015

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Tilak Gaitonde ,  Prashanth Pavithran

IPC: F28D19/04 ,  F28F5/02 ,  F28F3/02

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

公开(公告)号：US20240334589A1

公开(公告)日：2024-10-03

申请号：US18742367

申请日：2024-06-13

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/066 ,  H05K2201/10734

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

公开(公告)号：US11300363B2

公开(公告)日：2022-04-12

申请号：US16922015

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Tilak Gaitonde ,  Prashanth Pavithran

IPC: F28D19/04 ,  F28F3/02 ,  F28F5/02 ,  F28D21/00

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

公开(公告)号：US12069794B2

公开(公告)日：2024-08-20

申请号：US17858819

申请日：2022-07-06

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/066 ,  H05K2201/10734

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

公开(公告)号：US20240015880A1

公开(公告)日：2024-01-11

申请号：US17858819

申请日：2022-07-06

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/10734 ,  H05K2201/066

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.