公开(公告)号：US20170125149A1

公开(公告)日：2017-05-04

申请号：US15408063

申请日：2017-01-17

Applicant: Cisco Technology, Inc.

Inventor： William F. Edwards ,  George Edward Curtis ,  Ki Yuen Chau ,  Sandeep Arvindkumar Patel ,  Keith Frank Tharp ,  Robin Carol Johnson ,  Yu Liu ,  Billie Alton Hudson

IPC: H01F27/06 ,  H01R13/66 ,  H01F27/29 ,  H01R12/51 ,  H01F27/34 ,  H01F17/06 ,  H01R13/6461 ,  H01R13/719

Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

公开(公告)号：US09576716B2

公开(公告)日：2017-02-21

申请号：US14140421

申请日：2013-12-24

Applicant: Cisco Technology, Inc.

Inventor： William F. Edwards ,  George Edward Curtis ,  Ki Yuen Chau ,  Sandeep Arvindkumar Patel ,  Keith Frank Tharp ,  Robin Carol Johnson ,  Yu Liu ,  Billie Alton Hudson

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/29 ,  H01F27/04 ,  H01F27/06 ,  H01F17/06 ,  H01F27/30 ,  H01R13/719 ,  H01R13/66 ,  H01F17/00 ,  H01R13/6461

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/027 ,  H01F27/04 ,  H01F27/29 ,  H01F27/292 ,  H01F27/306 ,  H01F27/34 ,  H01F2017/0093 ,  H01F2027/065 ,  H01F2027/297 ,  H01R12/51 ,  H01R13/6461 ,  H01R13/6633 ,  H01R13/719

Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Abstract translation: 本发明涉及用于以太网应用的改进的共模扼流圈（CMC）和集成连接器模块（ICM）设计。 一些方面提供了一种改进的CMC组件，包括具有从上机架元件的边缘垂直突出的第一多个梳形结构的上机架元件，以及下机架元件，其包括从第一多个梳形结构 下部机架元件，第二多个梳状结构被配置为当上部机架元件与下部机架元件机械联接时，与第一多个梳状结构互锁以形成外壳。

公开(公告)号：US10522280B2

公开(公告)日：2019-12-31

申请号：US15408063

申请日：2017-01-17

Applicant: Cisco Technology, Inc.

Inventor： William F. Edwards ,  George Edward Curtis ,  Ki Yuen Chau ,  Sandeep Arvindkumar Patel ,  Keith Frank Tharp ,  Robin Carol Johnson ,  Yu Liu ,  Billie Alton Hudson

IPC: H01F27/28 ,  H01F27/06 ,  H01F27/04 ,  H01F27/29 ,  H01F17/06 ,  H01F27/02 ,  H01F27/30 ,  H01R13/66 ,  H01R13/6461 ,  H01R13/719 ,  H01F27/34 ,  H01R12/51 ,  H01F17/00

Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

公开(公告)号：US20150179328A1

公开(公告)日：2015-06-25

申请号：US14140421

申请日：2013-12-24

Applicant: Cisco Technology, Inc.

Inventor： William F. Edwards ,  George Edward Curtis ,  Ki Yuen Chau ,  Sandeep Arvindkumar Patel ,  Keith Frank Tharp ,  Robin Carol Johnson ,  Yu Liu ,  Billie Alton Hudson

IPC: H01F27/04 ,  H01F27/29 ,  H01F27/06

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/027 ,  H01F27/04 ,  H01F27/29 ,  H01F27/292 ,  H01F27/306 ,  H01F27/34 ,  H01F2017/0093 ,  H01F2027/065 ,  H01F2027/297 ,  H01R12/51 ,  H01R13/6461 ,  H01R13/6633 ,  H01R13/719

Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Abstract translation: 本发明涉及用于以太网应用的改进的共模扼流圈（CMC）和集成连接器模块（ICM）设计。 一些方面提供了一种改进的CMC组件，包括具有从上机架元件的边缘垂直突出的第一多个梳形结构的上机架元件，以及下机架元件，其包括从第一多个梳形结构 下部机架元件，第二多个梳状结构被配置为当上部机架元件与下部机架元件机械联接时，与第一多个梳状结构互锁以形成外壳。