Wire-wound coil component and drum core

    公开(公告)号:US11817246B2

    公开(公告)日:2023-11-14

    申请号:US16722957

    申请日:2019-12-20

    发明人: Katsuyuki Horie

    摘要: One object of the present invention is to provide a wire-wound coil component and a drum core that can be manufactured easily and less affected by an inter-wire capacitance. A coil component includes: a drum core having a winding core extending along a front-rear direction and a first flange provided on a front end of the winding core; a first conductor wire wound around the winding core of the drum core; and a second conductor wire wound on an outer side of the first conductor wire in a direction orthogonal to the front-rear direction, wherein turns of a same number of the first conductor wire and the second conductor wire contact with each other, while turns of different numbers of the first conductor wire and the second conductor wire are separated from each other.

    WIRE-WOUND COIL ELEMENT
    7.
    发明申请

    公开(公告)号:US20180226181A1

    公开(公告)日:2018-08-09

    申请号:US15861203

    申请日:2018-01-03

    摘要: One object of the present invention is to provide a coil element having a reduced thickness but is less prone to be broken. The coil element according to an embodiment of the present invention has a rectangular parallelepiped shape and has a principal surface including long sides and short sides. The coil element includes a drum core, a winding wound around the drum core, a first external electrode electrically connected to one end of the winding, and a second external electrode electrically connected to the other end of the winding. The drum core in the embodiment includes a first flange, a second flange, and a winding core connecting between the first flange and the second flange. The winding core extends along the short sides of the principal surface.

    Electronic apparatus
    8.
    发明授权

    公开(公告)号:US09991044B2

    公开(公告)日:2018-06-05

    申请号:US15246993

    申请日:2016-08-25

    摘要: An electronic apparatus includes a base and an electronic module. The base includes first and second base walls, a separating wall connected between the first and second base walls, and two receiving spaces disposed at opposite sides of the separating wall. The electronic module includes a terminal unit, and two electronic units respectively received in the receiving spaces and connected to the terminal unit. The terminal unit includes two pairs of first terminals, each of which has a connecting section protruding from one of two opposite side surfaces of the second base wall, and two second terminals, each of which has two connecting sections respectively protruding from two opposite side surfaces of the first base wall.

    ELECTRICAL COMPONENT PACKAGE WITH REINFORCED MOLDED PINS

    公开(公告)号:US20180122547A1

    公开(公告)日:2018-05-03

    申请号:US15337180

    申请日:2016-10-28

    申请人: XFMRS, Inc,

    IPC分类号: H01F27/04 H01R12/57 H05K3/34

    摘要: An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.